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BZX585-B75

Nexperia · Zener Diodes · SOD-523(SC-79)

BZX585-B75 from Nexperia, in a SOD-523(SC-79). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Zener diode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-523(SC-79)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage VZ 73.5 76.5 V IZ = 2 mA, Tj = 25 °C 6
Differential resistance rdiff 170 500 Ω IZ = 2 mA 6
Differential resistance rdiff 95 255 Ω IZ = 0.5 mA 6
Reverse current IR 0.05 µA VR = 52.5 V 6
Temperature coefficient SZ 73.4 80.2 88.6 mV/K IZ = 2 mA 6
Diode capacitance Cd 35 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 0.2 A tp = 100 µs; square wave; Tj = 25 °C before surge 6
Forward voltage VF 0.9 V IF = 10 mA, pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Forward voltage VF 1.1 V IF = 100 mA, pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tamb = 25 °C; prior to surge 3
Total power dissipation Ptot 300 mW Tamb = 25 °C, FR4 PCB with approx. 35 mm2 Cu area at cathode tab 3
Junction temperature Tj -65 150 °C 3
Ambient temperature Tamb -65 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance junction to ambient Rth(j-a) 350 K/W in free air, FR4 PCB with approx. 35 mm2 Cu area at cathode tab 3
Thermal resistance junction to solder point Rth(j-sp) 65 K/W Soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZX585-B75
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523(SC-79) (KiCad packages3D, STEP)
  • 3D model files: bzx585-b75-etched.step / bzx585-b75-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx585-b75.step / bzx585-b75.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 ce6f045443a822c0, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF