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BZX585-B4V3

Nexperia · Zener Diodes · SOD-523(SC-79)

BZX585-B4V3 from Nexperia, in a SOD-523(SC-79). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, indicated by the marking bar on the package; the cathode tab is the reference for the stated total power dissipation of 300 mW (device mounted on FR4 PCB with about 35 mm² Cu at the cathode tab) and for the thermal resistance junction-to-solder-point (65 K/W max).
2 A passive Anode of the Zener diode; the datasheet gives no pin-specific limit for this terminal, so the device ratings apply (for example forward current IF max 200 mA and Tj −65 °C to 150 °C).

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-523(SC-79)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (B tolerance series, nominal 4.3 V) VZ 4.21 4.39 V Tj = 25 °C unless otherwise specified 4
Working voltage tolerance (B series) VZ tolerance -2 2 % Sel B (±2 % series) 1
Differential resistance (rdiff, upper-current column pair) rdiff 410 600 Ω IZ = 1 mA 4
Differential resistance (rdiff, lower-current column pair) rdiff 80 90 Ω IZ = 5 mA 4
Temperature coefficient SZ -3.5 -1.7 0 mV/K IZ = 5 mA 4
Reverse current IR 3 µA VR = 1.0 V 4
Diode capacitance Cd 350 pF f = 1 MHz; VR = 0 V 4
Non-repetitive peak reverse current IZSM 6 A tp = 100 µs; square wave; Tj = 25 °C before surge 4
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 4
Forward voltage VF 1.1 V IF = 100 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 4
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tamb = 25 °C; prior to surge 3
Total power dissipation Ptot 300 mW Tamb = 25 °C; FR4 PCB, approx. 35 mm² Cu at cathode tab 3
Junction temperature Tj -65 150 °C 3
Ambient temperature Tamb -65 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance, junction to ambient Rth(j-a) 350 K/W In free air; FR4 PCB, approx. 35 mm² Cu at cathode tab 3
Thermal resistance, junction to solder point Rth(j-sp) 65 K/W Soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZX585-B4V3
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523(SC-79) (KiCad packages3D, STEP)
  • 3D model files: bzx585-b4v3-etched.step / bzx585-b4v3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx585-b4v3.step / bzx585-b4v3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 ce6f045443a822c0, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF