component
BZX584C3V3-HG3-08
Public Made by Adomby adom
Vishay Intertech Zener Diodes, SOD-523. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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BZX584C3V3-HG3-08
Vishay Intertech · Zener Diodes · SOD-523
BZX584C3V3-HG3-08 from Vishay Intertech, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOD-523 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage | VZ | 3.1 | 3.3 | 3.5 | V | at IZT1 = 5 mA | 2 |
| Test current 1 | IZT1 | 5 | mA | 2 | |||
| Test current 2 | IZT2 | 1 | mA | 2 | |||
| Reverse leakage current | IR | 5 | μA | at VR = 1 V | 2 | ||
| Dynamic resistance | ZZ | 95 | Ω | at IZT1 | 2 | ||
| Dynamic resistance (knee) | ZZK | 600 | Ω | at IZT2 | 2 | ||
| Temperature coefficient of Zener voltage | -8 | -3 | 10-4/°C | VZ at IZT1 | 2 | ||
| Power dissipation (recommended footprint) | Ptot | 200 | mW | On FR-4 board with recommended soldering footprint | 1 | ||
| Power dissipation (5 mm x 5 mm footprint) | Ptot | 300 | mW | On FR-4 board with 5 mm x 5 mm footprint | 1 | ||
| Junction temperature | Tj | 150 | °C | 1 | |||
| Storage temperature range | Tstg | -65 | 150 | °C | 1 | ||
| Thermal resistance junction to ambient (recommended footprint) | RthJA | 600 | K/W | JEDEC 51-3 on FR-4 board with recommended soldering footprint | 1 | ||
| Thermal resistance junction to ambient (5 mm x 5 mm footprint) | RthJA | 400 | K/W | JEDEC 51-3 on FR-4 board with 5 mm x 5 mm footprint | 1 | ||
| Thermal resistance junction to lead | RthJL | 200 | K/W | Infinite heatsink | 1 |
CAD (KiCad official)
- Symbol:
BZX584C3V3-HG3-08 - Footprint:
Diode_SMD:D_SOD-523 - 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files:
bzx584c3v3-hg3-08-etched.step/bzx584c3v3-hg3-08-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzx584c3v3-hg3-08.step/bzx584c3v3-hg3-08.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (4 pp, sha256
66305689def9f2a0, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BZX584C3V3-HG3-08
**Vishay Intertech** · Zener Diodes · SOD-523
BZX584C3V3-HG3-08 from Vishay Intertech, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOD-523 |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage | VZ | 3.1 | 3.3 | 3.5 | V | at IZT1 = 5 mA | 2 |
| Test current 1 | IZT1 | | 5 | | mA | | 2 |
| Test current 2 | IZT2 | | 1 | | mA | | 2 |
| Reverse leakage current | IR | | | 5 | μA | at VR = 1 V | 2 |
| Dynamic resistance | ZZ | | | 95 | Ω | at IZT1 | 2 |
| Dynamic resistance (knee) | ZZK | | | 600 | Ω | at IZT2 | 2 |
| Temperature coefficient of Zener voltage | | -8 | | -3 | 10-4/°C | VZ at IZT1 | 2 |
| Power dissipation (recommended footprint) | Ptot | | | 200 | mW | On FR-4 board with recommended soldering footprint | 1 |
| Power dissipation (5 mm x 5 mm footprint) | Ptot | | | 300 | mW | On FR-4 board with 5 mm x 5 mm footprint | 1 |
| Junction temperature | Tj | | | 150 | °C | | 1 |
| Storage temperature range | Tstg | -65 | | 150 | °C | | 1 |
| Thermal resistance junction to ambient (recommended footprint) | RthJA | | | 600 | K/W | JEDEC 51-3 on FR-4 board with recommended soldering footprint | 1 |
| Thermal resistance junction to ambient (5 mm x 5 mm footprint) | RthJA | | | 400 | K/W | JEDEC 51-3 on FR-4 board with 5 mm x 5 mm footprint | 1 |
| Thermal resistance junction to lead | RthJL | | | 200 | K/W | Infinite heatsink | 1 |
## CAD (KiCad official)
- Symbol: `BZX584C3V3-HG3-08`
- Footprint: `Diode_SMD:D_SOD-523`
- 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files: `bzx584c3v3-hg3-08-etched.step` / `bzx584c3v3-hg3-08-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bzx584c3v3-hg3-08.step` / `bzx584c3v3-hg3-08.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Vishay Intertech datasheet](docs/bzx584c3v3-hg3-08-datasheet.pdf) (4 pp, sha256 `66305689def9f2a0`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bzx584c3v3-hg3-08-datasheet.pdf)