# BZX584C24-TP

**MCC(Micro Commercial Components)** · Zener Diodes · SOD-523

BZX584C24-TP from MCC(Micro Commercial Components), in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode of the Zener diode (marked end); for BZX584C24 Vz is 22.8V min to 25.6V max (24V nominal) at IZT=5mA. |
| 2 | Anode | passive | Anode of the Zener diode; maximum forward voltage is 0.9V at IF=10mA. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MCC(Micro Commercial Components) |
| Package | SOD-523 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener Voltage | VZ | 22.8 | 24 | 25.6 | V | IZT=5mA, pulses period=5ms, width=300us | 2 |
| Maximum Zener Impedance | ZZT |  |  | 70 | Ω | IZT=5mA, f=1KHz | 2 |
| Maximum Zener Impedance (knee) | ZZK |  |  | 250 | Ω | IZK=1.0mA, f=1KHz | 2 |
| Maximum Reverse Current | IR |  |  | 0.1 | µA | VR=16.8V | 2 |
| Typical Temperature Coefficient |  | 18.4 |  | 22 | mV/℃ | @ IZT | 2 |
| Maximum Forward Voltage | VF |  |  | 0.9 | V | IF=10mA | 1 |
| Power Dissipation | PD |  |  | 150 | mW | Note 2 | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 150 | °C |  | 1 |
| Thermal Resistance Junction to Ambient | RθJA |  |  | 833 | °C/W | Junction to Ambient | 1 |
| Test Current | IZT |  | 5 |  | mA |  | 2 |
| Knee Test Current | IZK |  | 1 |  | mA |  | 2 |

## CAD (KiCad official)

- Symbol: `BZX584C24-TP`
- Footprint: `Diode_SMD:D_SOD-523`
- 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files: `bzx584c24-tp-etched.step` / `bzx584c24-tp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bzx584c24-tp.step` / `bzx584c24-tp.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MCC(Micro Commercial Components) datasheet](docs/bzx584c24-tp-datasheet.pdf) (4 pp, sha256 `f352156aac356931`, retrieved 2026-10-31, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bzx584c24-tp-datasheet.pdf)