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BZX384-B12

Nexperia · Zener Diodes · SOD-323

BZX384-B12 from Nexperia, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the 12 V (±2 %, VZ 11.80-12.20 V at IZ = 5 mA) voltage regulator diode; the marking bar indicates the cathode.
2 A passive Anode of the voltage regulator diode; forward voltage max 0.9 V at IF = 10 mA and IF max 250 mA.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (B grade) VZ 11.8 12 12.2 V IZ = 5 mA, Tj = 25 °C 6
Maximum differential resistance rdif 150 Ω IZ = 1 mA 6
Maximum differential resistance rdif 25 Ω IZ = 5 mA 6
Reverse current IR 0.1 μA VR = 8 V 6
Temperature coefficient SZ 6 10 mV/K IZ = 5 mA 6
Diode capacitance Cd 85 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 2.5 A tp = 100 μs; square wave; Tj = 25 °C 6
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 100 μs; δ ≤ 0.02 4
Forward voltage VF 1.1 V IF = 100 mA; pulse test tp ≤ 100 μs; δ ≤ 0.02 4
Forward current IF 250 mA 4
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge 4
Total power dissipation Ptot 300 mW Tamb ≤ 25 °C 4
Junction temperature Tj 150 °C 4
Ambient temperature Tamb -65 150 °C 4
Storage temperature Tstg -65 150 °C 4
Thermal resistance from junction to ambient Rth(j-a) 415 K/W in free air; FR4 PCB, single-sided copper, tin-plated, standard footprint 4
Thermal resistance from junction to solder point Rth(j-sp) 110 K/W soldering point of cathode tab 4
Tolerance of working voltage (B series) -2 2 % BZX384-B 1

CAD (KiCad official)

  • Symbol: BZX384-B12
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: bzx384-b12-etched.step / bzx384-b12-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx384-b12.step / bzx384-b12.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (14 pp, sha256 a381ee1ec1ad5a2b, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF