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BZV55-B47

Public Made by Adom

by adom

Nexperia Zener Diodes, MiniMELF. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BZV55-B47

Nexperia · Zener Diodes · MiniMELF

BZV55-B47 from Nexperia, in a MiniMELF. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 cathode passive Cathode, identified by the marking band on the package; the datasheet gives no pin-specific limits beyond the device ratings in Table 5.
2 anode passive Anode (the 'a' terminal of the graphic symbol, opposite the cathode); the datasheet gives no pin-specific limits beyond the device ratings in Table 5.

Key specifications

Parameter Value
Manufacturer Nexperia
Package MiniMELF
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Voltage tolerance (BZV55-B, E24 2 %) -2 2 % 1
Working voltage VZ 46.1 47.9 V Tj = 25 C unless otherwise specified 6
Differential resistance (first rdif column group) rdif 85 375 Ω IZ = 2 mA 6
Differential resistance (second rdif column group) rdif 50 170 Ω IZ = 0.5 mA 6
Temperature coefficient SZ 35 42.9 51.8 mV/K IZ = 2 mA 6
Diode capacitance Cd 50 pF IZ = 2 mA; f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 1 A IZ = 2 mA; tp = 100 µs; square wave; Tj = 25 C prior to surge 6
Reverse current (BZV55-B/C15 to BZV55-B/C75) IR 50 nA VR = 0.7VZ(nom) 3
Forward voltage VF 0.9 V IF = 10 mA 3
Forward current IF 250 mA 2
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tj = 25 C prior to surge 2
Total power dissipation Ptot 400 mW Tamb ≤ 50 C; device mounted on ceramic substrate 10 x 10 x 0.6 mm 2
Total power dissipation Ptot 500 mW Ttp ≤ 50 C; device mounted on ceramic substrate 10 x 10 x 0.6 mm 2
Storage temperature Tstg -65 200 °C 2
Junction temperature Tj -65 200 °C 2
Thermal resistance from junction to ambient Rth(j-a) 380 K/W in free air; device mounted on ceramic substrate 10 x 10 x 0.6 mm 2
Thermal resistance from junction to solder point Rth(j-sp) 300 K/W 2

CAD (KiCad official)

  • Symbol: BZV55-B47
  • Footprint: Diode_SMD:D_MiniMELF
  • 3D model: MiniMELF (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 1615551d4d7a75da, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF