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Ray Publish 0.1.0 8311d72 9d ago

BZV49-C12

Nexperia · Zener Diodes · SOT-89-3

BZV49-C12 from Nexperia, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 anode passive Anode of the BZV49-C12 voltage regulator diode; the datasheet's device limits apply, including continuous forward current 250 mA and total power dissipation 1 W at Tamb = 25 °C (device mounted on a ceramic substrate of 2.5 cm² and 0.7 mm thickness).
2 cathode passive Cathode of the BZV49-C12 voltage regulator diode, the reverse-regulation terminal; the BZV49-C12 nominal working voltage is 12 V with VZ 11.4 V min to 12.7 V max at IZtest 5 mA (page 5).
3 anode passive Second anode terminal of the SOT89 package; the datasheet's device limits apply, including non-repetitive peak reverse power dissipation PZSM max. 40 W (tp = 100 µs, Tj = 25 °C prior to surge).

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOT-89-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage VZ (min) VZ 11.4 V at IZtest = 5 mA 5
Working voltage VZ (max) VZ 12.7 V at IZtest = 5 mA 5
Differential resistance rdif (max) rdif 10 25 Ω at IZtest = 5 mA 5
Temperature coefficient SZ SZ 6 8.4 10 mV/K at IZtest = 5 mA; see Figs 4 and 5 5
Diode capacitance Cd (max) Cd 85 pF f = 1 MHz; VR = 0 V 5
Reverse current IR (max) IR 0.1 μA at VR = 8.0 V 5
Non-repetitive peak reverse current IZSM (max) IZSM 2.5 A tp = 100 μs; square wave; Tj = 25 °C prior to surge; Tamb = 25 °C 5
Continuous forward current IF 250 mA 3
Total power dissipation Ptot 1 W Tamb = 25 °C; note 1 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge; see Fig.2 3
Storage temperature Tstg -65 150 °C 3
Junction temperature Tj 150 °C 3
Forward voltage VF 1 V IF = 50 mA; see Fig.3 4
Thermal resistance junction to tie-point Rth(j-tp) 15 K/W 7
Thermal resistance junction to ambient Rth(j-a) 125 K/W note 1: device mounted on ceramic substrate; area = 2.5 cm2; thickness = 0.7 mm 7

CAD (KiCad official)

  • Symbol: BZV49-C12
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: bzv49-c12-etched.step / bzv49-c12-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzv49-c12.step / bzv49-c12.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 d11cb65034cc8cae, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF