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Ray Publish 0.1.0 9dea735 6d ago

BZT52HC18WF-7

Diodes Incorporated · Zener Diodes · SOD-123F

BZT52HC18WF-7 from Diodes Incorporated, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the cathode band; the Zener (BZT52HC18WF: VZ 16.8V min to 19.1V max at IZT = 5mA) is reverse biased with this terminal positive, and the datasheet notes a 1cm2 cathode mounting pad gives PD 830mW.
2 A passive Anode, the terminal opposite the cathode band; forward voltage VF is 0.9V at IF = 10mA with a maximum forward current of 250mA.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOD-123F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 16.8 19.1 V IZT = 5mA 3
Maximum Zener Impedance ZZT 20 Ω @ IZT = 5mA, f = 1kHz 3
Maximum Zener Impedance (knee) ZZK 170 Ω @ IZK = 1mA, f = 1kHz 3
Temperature Coefficient TC 12.4 16 mV/°C @ IZT = 5mA 3
Total Capacitance CT 70 pF f = 1MHz, VR = 0V 3
Maximum Reverse Current IR 0.05 µA VR = 12.6V 3
Forward Voltage VF 0.9 V IF = 10mA, TA = +25°C 2
Forward Current IF 250 mA TA = +25°C 2
Power Dissipation (Note 6) PD 375 mW Minimum recommended pad layout, FR-4 2
Power Dissipation (Note 7) PD 830 mW FR-4 PCB, cathode pad 1cm2 2
Thermal Resistance, Junction to Ambient (Note 6) RθJA 330 °C/W Minimum recommended pad layout, FR-4 2
Thermal Resistance, Junction to Ambient (Note 7) RθJA 150 °C/W FR-4 PCB, cathode pad 1cm2 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper Alloy tin  Terminal Connections: Cathode Band  Terminals: Finish - Matte Tin Annealed over Copper Alloy 1

CAD (KiCad official)

  • Symbol: BZT52HC18WF-7
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123F (KiCad packages3D, STEP)
  • 3D model files: bzt52hc18wf-7-etched.step / bzt52hc18wf-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzt52hc18wf-7.step / bzt52hc18wf-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 251bfd6eb9903714, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF