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BZT52H-C12

Public Made by Adom

by adom

Nexperia Zener Diodes, SOD-123F. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BZT52H-C12

Nexperia · Zener Diodes · SOD-123F

BZT52H-C12 from Nexperia, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Zener diode, identified by the marking bar; it is the soldering point of the cathode tab (Rth(j-sp) ≤ 70 K/W) and a 1 cm² cathode mounting pad gives Ptot ≤ 830 mW.
2 A passive Anode of the Zener diode; forward current IF is limited to 250 mA and VF is ≤ 0.9 V at IF = 10 mA.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (C selection) VZ 11.4 12.7 V IZ = 5 mA; Tj = 25 °C 6
Maximum differential resistance rdif 90 Ω IZ = 1 mA 6
Maximum differential resistance rdif 10 Ω IZ = 5 mA 6
Reverse current IR 0.1 µA VR = 8 V 6
Temperature coefficient SZ 6 10 mV/K IZ = 5 mA 6
Diode capacitance Cd 85 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 2.5 A tp = 100 µs; Tamb = 25 °C 6
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 4
Forward current IF 250 mA 4
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tj = 25 °C prior to surge 4
Total power dissipation Ptot 375 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 4
Total power dissipation Ptot 830 mW Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm2 4
Junction temperature Tj 150 °C 4
Ambient temperature Tamb -65 150 °C 4
Storage temperature Tstg -65 150 °C 4
Thermal resistance junction to ambient Rth(j-a) 330 K/W in free air; FR4 PCB, standard footprint 4
Thermal resistance junction to ambient Rth(j-a) 150 K/W in free air; FR4 PCB, mounting pad for cathode 1 cm2 4
Thermal resistance junction to solder point Rth(j-sp) 70 K/W soldering point of cathode tab 4

CAD (KiCad official)

  • Symbol: BZT52H-C12
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123F (KiCad packages3D, STEP)
  • 3D model files: bzt52h-c12-etched.step / bzt52h-c12-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzt52h-c12.step / bzt52h-c12.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (14 pp, sha256 a5e54de45bdf1af7, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF