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BZT52H-B22

Nexperia · Zener Diodes · SOD-123F

BZT52H-B22 from Nexperia, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (B selection, 22 V type) VZ 21.6 22.4 V IZ = 5 mA 6
Maximum differential resistance rdif 220 Ω IZ = 1 mA 6
Maximum differential resistance rdif 25 Ω IZ = 5 mA 6
Reverse current IR 0.05 μA VR = 15.4 V (Max VR column) 6
Temperature coefficient SZ 16.4 20 mV/K IZ = 5 mA 6
Diode capacitance Cd 60 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 1.25 A tp = 100 μs; Tamb = 25 °C 6
Forward current IF 250 mA 4
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge 4
Total power dissipation (standard footprint) Ptot 375 mW Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint 4
Total power dissipation (cathode pad 1 cm²) Ptot 830 mW FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² 4
Junction temperature Tj 150 °C 4
Ambient temperature Tamb -65 150 °C 4
Storage temperature Tstg -65 150 °C 4
Thermal resistance junction to ambient (standard footprint) Rth(j-a) 330 K/W in free air; FR4 PCB, single-sided copper, tin-plated, standard footprint 4
Thermal resistance junction to ambient (cathode pad 1 cm²) Rth(j-a) 150 K/W FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² 4
Thermal resistance junction to solder point Rth(j-sp) 70 K/W soldering point of cathode tab 4
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 4

CAD (KiCad official)

  • Symbol: BZT52H-B22
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123F (KiCad packages3D, STEP)
  • 3D model files: bzt52h-b22-etched.step / bzt52h-b22-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzt52h-b22.step / bzt52h-b22.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (14 pp, sha256 a5e54de45bdf1af7, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF