component

BZT52H-B10

Public Made by Adom

by adom

Nexperia Zener Diodes, SOD-123F. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BZT52H-B10

Nexperia · Zener Diodes · SOD-123F

BZT52H-B10 from Nexperia, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Zener diode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode, the terminal opposite the cathode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (B selection, nominal 10 V) VZ 9.8 10.2 V IZ = 5 mA; Tj = 25 °C 6
Tolerance, B selection -2 2 % Decoded from BZT52H-B10 Sel B (9.80-10.20 V at 10 V nominal) 6
Maximum differential resistance rdif 70 Ω IZ = 1 mA 6
Maximum differential resistance rdif 10 Ω IZ = 5 mA 6
Reverse current IR 0.2 μA VR = 7 V 6
Temperature coefficient SZ 4.5 8 mV/K IZ = 5 mA 6
Diode capacitance Cd 90 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 3 A tp = 100 μs; Tamb = 25 °C 6
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Forward current IF 250 mA 4
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge 4
Total power dissipation (standard footprint) Ptot 375 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 4
Total power dissipation (mounting pad for cathode 1 cm2) Ptot 830 mW Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm2 4
Junction temperature Tj 150 °C 4
Ambient temperature Tamb -65 150 °C 4
Storage temperature Tstg -65 150 °C 4
Thermal resistance junction to ambient (standard footprint) Rth(j-a) 330 K/W in free air; FR4 PCB, standard footprint 4
Thermal resistance junction to ambient (mounting pad for cathode 1 cm2) Rth(j-a) 150 K/W FR4 PCB, mounting pad for cathode 1 cm2 4
Thermal resistance junction to solder point Rth(j-sp) 70 K/W soldering point of cathode tab 4

CAD (KiCad official)

  • Symbol: BZT52H-B10
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123F (KiCad packages3D, STEP)
  • 3D model files: bzt52h-b10-etched.step / bzt52h-b10-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzt52h-b10.step / bzt52h-b10.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (14 pp, sha256 a5e54de45bdf1af7, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF