# BZT52C3V0 RHG

**Taiwan Semiconductor(Taiwan Semicon)** · Zener Diodes · SOD-123F

BZT52C3V0 RHG from Taiwan Semiconductor(Taiwan Semicon), in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor(Taiwan Semicon) |
| Package | SOD-123F |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage (min) | VZ | 2.85 |  |  | V | IZT = 5 mA | 2 |
| Zener voltage (max) | VZ |  |  | 3.15 | V | IZT = 5 mA | 2 |
| Zener voltage (nominal) | VZ |  | 3 |  | V | IZT = 5 mA | 2 |
| Zener impedance (max) | ZZT |  |  | 100 | Ω | IZT = 5 mA | 2 |
| Zener knee impedance (max) | ZZK |  |  | 564 | Ω | IZK = 1 mA | 2 |
| Leakage current (max) | IR |  |  | 9 | µA | VR = 1.0 V | 2 |
| Forward voltage (max) | VF |  |  | 1 | V | IF = 10 mA | 1 |
| Power dissipation (max) | PD |  |  | 500 | mW |  | 1 |
| Junction temperature range | TJ | -65 |  | 150 | °C |  | 1 |
| Storage temperature range | TSTG | -65 |  | 150 | °C |  | 1 |
| Junction-to-ambient thermal resistance | RθJA |  | 350 |  | °C/W |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Polarity: Indicated by cathode band | 1 |

## CAD (KiCad official)

- Symbol: `BZT52C3V0 RHG`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123F (KiCad packages3D, STEP)
- 3D model files: `bzt52c3v0-rhg-etched.step` / `bzt52c3v0-rhg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bzt52c3v0-rhg.step` / `bzt52c3v0-rhg.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Taiwan Semiconductor(Taiwan Semicon) datasheet](docs/bzt52c3v0-rhg-datasheet.pdf) (7 pp, sha256 `836a3e82183226e3`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bzt52c3v0-rhg-datasheet.pdf)