# BZT52C33T1G

**MOT** · Zener Diodes · SOD-123

BZT52C33T1G from MOT, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the zener diode (banded end); for BZT52C33T1G, VZ is 31.35 V min, 33 V nom and 34.65 V max at IZ=2mA. |
| 2 | A | passive | Anode of the zener diode; forward voltage is 0.85 V at IF=10mA and total power dissipation is 500 mW. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MOT |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage (nominal test current IZ=2mA) | VZ | 31.35 | 33 | 34.65 | V | IZ=2mA | 3 |
| Typical temperature coefficient (IZ=2mA) |  | 27.4 |  | 33.4 | mV/℃ | IZ=2mA | 3 |
| Zener voltage tolerance |  | -5 |  | 5 | % |  | 1 |
| Forward voltage | VF |  |  | 0.85 | V | IF=10mA | 1 |
| Total power dissipation | PD |  |  | 500 | mW |  | 1 |
| Thermal resistance junction-to-ambient (first printed value) | RθJA |  |  | 556 | ℃/W |  | 1 |
| Thermal resistance junction-to-ambient (second printed value) | RθJA |  |  | 417 | ℃/W |  | 1 |
| Maximum operating junction temperature | Tj |  |  | 150 | ℃ |  | 1 |
| Storage temperature | Tstg | -55 |  | 150 | ℃ |  | 1 |
| Dynamic impedance at IZ=0.5mA | ZZ |  | 320 |  |  | IZ=0.5mA | 3 |
| Dynamic impedance at IZ=2mA | ZZ |  | 75 |  |  | IZ=2mA | 3 |
| Dynamic impedance at IZ=10mA | ZZ |  | 53 |  |  | IZ=10mA | 3 |
| Reverse leakage current | IR |  | 0.04 |  | uA | VR=23V | 3 |

## CAD (KiCad official)

- Symbol: `BZT52C33T1G`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files: `bzt52c33t1g-etched.step` / `bzt52c33t1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bzt52c33t1g.step` / `bzt52c33t1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MOT datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603003390817415168) (5 pp, sha256 `7f647f3c8e84fff3`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bzt52c33t1g-datasheet.pdf)