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BZT52C30-G RHG
Public Made by Adomby adom
Taiwan Semiconductor Zener Diodes, SOD-123. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBZT52C30-G RHG
Taiwan Semiconductor · Zener Diodes · SOD-123
BZT52C30-G RHG from Taiwan Semiconductor, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage | VZ | 28 | 30 | 32 | V | IZT = 2 mA | 2 |
| Maximum zener impedance | ZZT | 80 | Ohm | @ IZT = 2 mA | 2 | ||
| Maximum zener impedance | ZZK | 300 | Ohm | @ IZK = 0.5 mA | 2 | ||
| Maximum reverse current | IR | 0.1 | μA | @ VR = 21.0 V | 2 | ||
| Typical temperature coefficient | 24.4 | 29.4 | mV/°C | @ IZTC = 2 mA | 2 | ||
| Power dissipation | PD | 350 | mW | Note 1: device mounted on ceramic PCB 7.6mm x 9.4mm x 0.87mm, pad areas 25mm2 | 1 | ||
| Thermal resistance, junction to ambient | RθJA | 357 | °C/W | Note 1: device mounted on ceramic PCB 7.6mm x 9.4mm x 0.87mm, pad areas 25mm2 | 1 | ||
| Junction temperature | TJ | 150 | °C | 1 | |||
| Storage temperature | TSTG | -55 | 150 | °C | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | - Case: Bend lead SOD-123 small outline plastic package - Terminal: Matte tin plated, lead free, solderable | 1 |
CAD (KiCad official)
- Symbol:
BZT52C30-G RHG - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files:
bzt52c30-g-rhg-etched.step/bzt52c30-g-rhg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzt52c30-g-rhg.step/bzt52c30-g-rhg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor datasheet (5 pp, sha256
e4d6f9de652ae6a1, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).