# BZT52B30

**CBI** · Zener Diodes · SOD-123

BZT52B30 from CBI, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the zener diode, identified as pin 1 in the datasheet pin description; the datasheet rates the device at 350 mW power dissipation on a ceramic PCB. |
| 2 | Anode | passive | Anode terminal of the zener diode, identified as pin 2 in the datasheet pin description; the forward voltage is listed as 0.9 V at IF = 10 mA. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CBI |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage (nominal 30 V, tolerance window) | VZ | 29.4 | 30 | 30.6 | V | @ IZT = 2 mA (Note 2: short duration test pulse) | 2 |
| Maximum reverse current | IR |  |  | 0.1 | µA | @ VR = 21.0 V | 2 |
| Maximum Zener impedance | ZZT |  |  | 80 | Ω | @ IZT = 2 mA (Note 3: f = 1kHz) | 2 |
| Maximum Zener impedance (knee) | ZZK |  |  | 300 | Ω | @ IZK = 0.5 mA (Note 3: f = 1kHz) | 2 |
| Typical temperature coefficient |  | 24.4 |  | 29.4 | mV/°C | @ IZTC = 2 mA | 2 |
| Power dissipation | Pd |  |  | 350 | mW | Device mounted on ceramic PCB (Note 1) | 1 |
| Forward voltage | VF |  |  | 0.9 | V | @ IF = 10 mA (Note 2) | 1 |
| Thermal resistance, junction to ambient | RθJA |  |  | 357 | /W |  | 1 |
| Junction temperature | Tj |  |  | 150 | ℃ |  | 1 |
| Storage temperature range | Tstg | -55 |  | 150 | ℃ |  | 1 |

## CAD (KiCad official)

- Symbol: `BZT52B30`
- Footprint: `Diode_SMD:D_SOD-123F`
- 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files: `bzt52b30-etched.step` / `bzt52b30-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bzt52b30.step` / `bzt52b30.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CBI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590917152159444992) (3 pp, sha256 `e1ada6342f248676`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bzt52b30-datasheet.pdf)