component
BZM55C3V3-TR
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Vishay Intertech Zener Diodes, SOD-323. Diode: pin 1 is the cathode (the banded end) by the KiCad diode-footprint convention, KiCad symbol/footprint/3D.
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BZM55C3V3-TR
Vishay Intertech · Zener Diodes · SOD-323
BZM55C3V3-TR from Vishay Intertech, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage | VZ | 3.1 | 3.3 | 3.5 | V | at IZT1 = 5 mA | 2 |
| Reverse leakage current | IR | 2 | μA | at Tamb = 25 °C | 2 | ||
| Reverse leakage current | IR | 40 | μA | at Tamb = 125 °C | 2 | ||
| Dynamic resistance | ZZ | 90 | Ω | at IZT1 = 5 mA, f = 1 kHz | 2 | ||
| Dynamic resistance | ZZK | 600 | Ω | at IZT2 = 1 mA | 2 | ||
| Temperature coefficient of VZ | TKVZ | -0.08 | -0.05 | %/K | 2 | ||
| Power dissipation | Ptot | 500 | mW | RthJA ≤ 300 K/W | 1 | ||
| Forward voltage | VF | 1.5 | V | IF = 200 mA | 1 | ||
| Junction temperature | Tj | 175 | °C | 1 | |||
| Storage temperature range | Tstg | -65 | 175 | °C | 1 | ||
| Junction to ambient air thermal resistance | RthJA | 500 | K/W | Mounted on epoxy-glass hard tissue, fig. 1 | 1 | ||
| Junction tie point thermal resistance | RthJL | 300 | K/W | 35 μm copper clad, 0.9 mm2 copper area per electrode | 1 |
CAD (KiCad official)
- Symbol:
BZM55C3V3-TR - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
bzm55c3v3-tr-etched.step/bzm55c3v3-tr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzm55c3v3-tr.step/bzm55c3v3-tr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (7 pp, sha256
a61812afcd0981c7, retrieved 2026-10-26, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BZM55C3V3-TR
**Vishay Intertech** · Zener Diodes · SOD-323
BZM55C3V3-TR from Vishay Intertech, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener voltage | VZ | 3.1 | 3.3 | 3.5 | V | at IZT1 = 5 mA | 2 |
| Reverse leakage current | IR | | | 2 | μA | at Tamb = 25 °C | 2 |
| Reverse leakage current | IR | | | 40 | μA | at Tamb = 125 °C | 2 |
| Dynamic resistance | ZZ | | | 90 | Ω | at IZT1 = 5 mA, f = 1 kHz | 2 |
| Dynamic resistance | ZZK | | | 600 | Ω | at IZT2 = 1 mA | 2 |
| Temperature coefficient of VZ | TKVZ | -0.08 | | -0.05 | %/K | | 2 |
| Power dissipation | Ptot | | | 500 | mW | RthJA ≤ 300 K/W | 1 |
| Forward voltage | VF | | | 1.5 | V | IF = 200 mA | 1 |
| Junction temperature | Tj | | | 175 | °C | | 1 |
| Storage temperature range | Tstg | -65 | | 175 | °C | | 1 |
| Junction to ambient air thermal resistance | RthJA | | | 500 | K/W | Mounted on epoxy-glass hard tissue, fig. 1 | 1 |
| Junction tie point thermal resistance | RthJL | | | 300 | K/W | 35 μm copper clad, 0.9 mm2 copper area per electrode | 1 |
## CAD (KiCad official)
- Symbol: `BZM55C3V3-TR`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `bzm55c3v3-tr-etched.step` / `bzm55c3v3-tr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bzm55c3v3-tr.step` / `bzm55c3v3-tr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Vishay Intertech datasheet](docs/bzm55c3v3-tr-datasheet.pdf) (7 pp, sha256 `a61812afcd0981c7`, retrieved 2026-10-26, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bzm55c3v3-tr-datasheet.pdf)