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Contents

README

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BZG05C13-HM3-08

Vishay Intertech · Zener Diodes · SMA(DO-214AC)

BZG05C13-HM3-08 from Vishay Intertech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ VZ 12.4 13 14.1 V at IZT1 = 20 mA 2
Dynamic resistance ZZ ZZ 10 Ω at IZT1 = 20 mA 2
Dynamic resistance ZZK ZZK 400 Ω at IZT2 = 0.5 mA 2
Reverse leakage current IR IR 0.5 μA at VR = 10 V 2
Temperature coefficient of VZ TCVZ (min) TCVZ 0.05 %/K at IZT1 = 20 mA 2
Temperature coefficient of VZ TCVZ (max) TCVZ 0.085 %/K at IZT1 = 20 mA 2
Forward voltage (max.) VF 1.2 V IF = 0.2 A 1
Power dissipation Ptot Ptot 3000 mW RthJA < 30 K/W, Tamb = 60 °C 1
Power dissipation Ptot Ptot 1250 mW RthJA < 100 K/W, Tamb = 25 °C 1
Non repetitive peak surge power dissipation PZSM 60 W tp = 100 μs sq. pulse, Tj = 25 °C prior to surge 1
Junction temperature Tj 150 °C 1
Storage temperature range Tstg -65 150 °C 1
Operating temperature range Top -65 150 °C 1
Junction to lead thermal resistance RthJL 30 K/W Junction to lead 1
Junction to ambient thermal resistance RthJA 150 K/W Mounted on epoxy-glass hard tissue, fig. 1a 1
Junction to ambient thermal resistance RthJA 125 K/W Mounted on epoxy-glass hard tissue, fig. 1b 1
Junction to ambient thermal resistance RthJA 100 K/W Mounted on Al2O3 ceramic, fig. 1b 1

CAD (KiCad official)

  • Symbol: BZG05C13-HM3-08
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: bzg05c13-hm3-08-etched.step / bzg05c13-hm3-08-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzg05c13-hm3-08.step / bzg05c13-hm3-08.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (5 pp, sha256 d66a23d254d40fd5, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF