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BZG03C33-M3-08

Public Made by Adom

by adom

Vishay Intertech Zener Diodes, SMA(DO-214AC). Diode: pin 1 is the cathode (the banded end) by the KiCad diode-footprint convention, KiCad symbol/footprint/3D.

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BZG03C33-M3-08

Vishay Intertech · Zener Diodes · SMA(DO-214AC)

BZG03C33-M3-08 from Vishay Intertech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal 33 V) VZ 31 33 35 V at IZT1 = 25 mA 2
Reverse leakage current IR 1 μA at VR = 24 V 2
Dynamic resistance ZZ 8 15 Ω at IZT1 = 25 mA 2
Temperature coefficient of zener voltage TKVZ 0.06 0.11 %/K at IZT1 = 25 mA 2
Power dissipation Ptot 3000 mW RthJA < 25 K/W 1
Power dissipation Ptot 1250 mW RthJA < 100 K/W 1
Non repetitive peak surge power PZSM 600 W tp = 100 μs sq. pulse, Tj = 25 °C prior to surge 1
Forward voltage (max.) VF 1.2 V IF = 0.5 A 1
Junction temperature Tj 150 °C 1
Storage temperature range Tstg -65 150 °C 1
Operating temperature range Top -65 150 °C 1
Thermal resistance junction to lead RthJL 25 K/W junction to lead 1
Thermal resistance junction to ambient RthJA 150 K/W mounted on epoxy-glass hard tissue, fig. 1a 1
Thermal resistance junction to ambient RthJA 125 K/W mounted on epoxy-glass hard tissue, fig. 1b 1
Thermal resistance junction to ambient RthJA 100 K/W mounted on Al2O3 ceramic, fig. 1b 1

CAD (KiCad official)

  • Symbol: BZG03C33-M3-08
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: bzg03c33-m3-08-etched.step / bzg03c33-m3-08-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzg03c33-m3-08.step / bzg03c33-m3-08.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (5 pp, sha256 502d306585644b09, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF