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Contents

README

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BZD27C75P

LGE · Zener Diodes · SOD-123FL

BZD27C75P from LGE, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the cathode band (color band denotes positive end); zener working voltage Vz is 70 V min to 79 V max at IZT = 10 mA for the BZD27C75P.
2 A passive Anode of the zener diode; the datasheet does not print pin numbers, only the cathode band on the SOD-123FL case.

Key specifications

Parameter Value
Manufacturer LGE
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage Vz 70 79 V @IZT, pulse test tp<=5ms, TJ=25 2
Differential resistance rdif 30 100 Ω @Iz 2
Temperature coefficient αz 0.08 0.13 %/°C @Iz 2
Test current IZT 10 mA Regulator use, as printed in table column 2
Reverse current IR 1 µA @VR=56 V 2
Reverse voltage for IR VR 56 V Reverse current test voltage 2
Reverse breakdown voltage V(BR)R 70 V Protection use, @Itest 3
Test current Itest 10 mA Protection use 3
Temperature coefficient αz 0.08 0.13 %/°C @Itest 3
Clamping voltage VC 103.5 V @IRSM 3
Peak reverse surge current IRSM 1.5 A 10/1000µs pulse 3
Reverse current at stand-off voltage IR 5 µA @VWM 3
Stand-off voltage VWM 62 V 3
Non-repetitive peak pulse power dissipation PPPM 150 Watts 10/1000µs waveform, TJ=25 prior to surge 1
Power dissipation Ptot 0.8 Watts TA=25, mounted on epoxy-glass PCB 3x3 mm Cu pads 1
Maximum instantaneous forward voltage VF 1.2 Volts at 0.2A 1
Thermal resistance junction to ambient RθJA 180 K/W 1
Operating junction temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1

CAD (KiCad official)

  • Symbol: BZD27C75P
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: bzd27c75p-etched.step / bzd27c75p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzd27c75p.step / bzd27c75p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LGE datasheet (4 pp, sha256 2bd30e901b20ecdb, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF