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BYG24D-E3

Vishay Intertech · Avalanche Diodes · DO-214AC(SMA)

BYG24D-E3 from Vishay Intertech, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the color band on the SMA (DO-214AC) package; blocks up to VRRM of 200 V for BYG24D when reverse biased.
2 A passive Anode terminal of the single fast avalanche rectifier diode, rated for 1.5 A average forward current (IF(AV)).

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package DO-214AC(SMA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 200 V TA = 25 °C 1
Average forward current IF(AV) 1.5 A TA = 65 °C 1
Peak forward surge current IFSM 30 A 10 ms single half sine-wave superimposed on rated load 1
Pulse energy in avalanche mode, non repetitive ER 20 mJ I(BR)R = 1 A, TJ = 25 °C, inductive load switch off 1
Operating junction and storage temperature range TJ, TSTG -55 150 °C 1
Minimum breakdown voltage VBR 200 V IR = 100 μA 2
Maximum instantaneous forward voltage VF 1.15 V IF = 1 A, TJ = 25 °C 2
Maximum instantaneous forward voltage VF 1.25 V IF = 1.5 A 2
Maximum reverse current IR 1 μA VR = VRRM, TJ = 25 °C 2
Maximum reverse current IR 10 μA VR = VRRM, TJ = 100 °C 2
Maximum reverse recovery time trr 140 ns IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 2
Thermal resistance junction to case RθJC 25 °C/W 2
Maximum thermal resistance, junction to ambient (1) RθJA (1) 150 °C/W Mounted on epoxy-glass hard tissue 35 μm x 17 mm2 copper area per electrode 2
Maximum thermal resistance, junction to ambient (2) RθJA (2) 125 °C/W Mounted on epoxy-glass hard tissue 35 μm x 50 mm2 copper area per electrode 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 1

CAD (KiCad official)

  • Symbol: BYG24D-E3
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
  • 3D model files: byg24d-e3-etched.step / byg24d-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); byg24d-e3.step / byg24d-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (4 pp, sha256 69cbba53fc2b131f, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF