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BYG23T-M3

Public Made by Adom

by adom

Vishay Intertech Avalanche Diodes, SMA(DO-214AC). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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BYG23T-M3

Vishay Intertech · Avalanche Diodes · SMA(DO-214AC)

BYG23T-M3 from Vishay Intertech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Instantaneous forward voltage (TA = 25 °C) VF 1.74 1.9 V IF = 1.0 A, TA = 25 °C 2
Instantaneous forward voltage (TA = 125 °C) VF 1.39 1.65 V IF = 1.0 A, TA = 125 °C 2
Reverse current (TA = 25 °C) IR 5 μA VR = 1300 V, TA = 25 °C 2
Reverse current (TA = 125 °C) IR 2.9 50 μA VR = 1300 V, TA = 125 °C 2
Maximum reverse recovery time trr 65 75 ns IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A, TA = 25 °C 2
Maximum repetitive peak reverse voltage VRRM 1300 V 1
Maximum DC forward current IF 1 A Free air, mounted on recommended copper pad area (note 1 of maximum ratings) 1
Peak forward surge current IFSM 18 A 8.3 ms single half sine-wave superimposed on rated load 1
Pulse energy in avalanche mode, non repetitive ER 5 mJ I(BR)R = 0.4 A, TL = 25 °C, inductive load switch off 1
Maximum operating junction temperature TJ 150 °C 1
Storage temperature range TSTG -55 150 °C 1
Forward recovery time tfr 620 IF = 1.5 A, dI/dt = 12 A/μs, VF = 1.1 x VF max., TA = 25 °C 2
Peak forward voltage VFP 9 V 2
Typical junction capacitance CJ 9 pF 4.0 V, 1 MHz 2
Typical thermal resistance, junction to ambient RJA 120 °C/W Free air, mounted on recommended PCB 1 oz. pad area 2
Typical thermal resistance, junction to mount RJM 20 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 1

CAD (KiCad official)

  • Symbol: BYG23T-M3
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: byg23t-m3-etched.step / byg23t-m3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); byg23t-m3.step / byg23t-m3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (5 pp, sha256 11ec9ff65cb8046f, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF