component
BYG22D
Public Made by Adomby adom
LGE Avalanche Diodes, SMA. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BYG22D
LGE · Avalanche Diodes · SMA
BYG22D from LGE, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked by the color band; reverse-blocking up to VRRM of 200 V for BYG22D. |
| 2 | A | passive | Anode, the end opposite the color band; average forward current up to 2.0 A with VF of 1.1 V at IF = 2.0 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | SMA |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum instantaneous forward voltage | VF | 1 | V | IF = 1.0 A, TJ = 25 °C | 2 | ||
| Maximum instantaneous forward voltage | VF | 1.1 | V | IF = 2.0 A, TJ = 25 °C | 2 | ||
| Maximum reverse current | IR | 1 | µA | VR = VRRM, TJ = 25 °C | 2 | ||
| Maximum reverse current | IR | 10 | µA | VR = VRRM, TJ = 100 °C | 2 | ||
| Maximum reverse recovery time | trr | 25 | ns | IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A | 2 | ||
| Maximum repetitive peak reverse voltage | VRRM | 200 | V | TA = 25 °C | 1 | ||
| Average forward current | IF(AV) | 2 | A | TA = 25 °C | 1 | ||
| Peak forward surge current | IFSM | 35 | A | 10 ms single half sine-wave superimposed on rated load | 1 | ||
| Pulse energy in avalanche mode, non repetitive | ER | 20 | mJ | I(BR)R = 1 A, TJ = 25 °C | 1 | ||
| Operating junction and storage temperature range | TJ, TSTG | -55 | 150 | °C | 1 | ||
| Thermal resistance, junction to lead | RθJL | 25 | °C/W | TL = const. | 2 | ||
| Thermal resistance, junction to ambient | RθJA (1) | 150 | °C/W | Mounted on epoxy-glass hard tissue | 2 | ||
| Thermal resistance, junction to ambient | RθJA (2) | 125 | °C/W | Mounted on epoxy-glass hard tissue, 50 mm2 35 μm Cu | 2 | ||
| Thermal resistance, junction to ambient | RθJA (3) | 100 | °C/W | Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 μm Cu | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
CAD (KiCad official)
- Symbol:
BYG22D - Footprint:
Diode_SMD:D_SMA - 3D model: SMA (KiCad packages3D, STEP)
- 3D model files:
byg22d-etched.step/byg22d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);byg22d.step/byg22d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LGE datasheet (4 pp, sha256
b2fc4f2b7bb00ccc, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BYG22D
**LGE** · Avalanche Diodes · SMA
BYG22D from LGE, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked by the color band; reverse-blocking up to VRRM of 200 V for BYG22D. |
| 2 | A | passive | Anode, the end opposite the color band; average forward current up to 2.0 A with VF of 1.1 V at IF = 2.0 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | SMA |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum instantaneous forward voltage | VF | | | 1 | V | IF = 1.0 A, TJ = 25 °C | 2 |
| Maximum instantaneous forward voltage | VF | | | 1.1 | V | IF = 2.0 A, TJ = 25 °C | 2 |
| Maximum reverse current | IR | | | 1 | µA | VR = VRRM, TJ = 25 °C | 2 |
| Maximum reverse current | IR | | | 10 | µA | VR = VRRM, TJ = 100 °C | 2 |
| Maximum reverse recovery time | trr | | | 25 | ns | IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A | 2 |
| Maximum repetitive peak reverse voltage | VRRM | | | 200 | V | TA = 25 °C | 1 |
| Average forward current | IF(AV) | | | 2 | A | TA = 25 °C | 1 |
| Peak forward surge current | IFSM | | | 35 | A | 10 ms single half sine-wave superimposed on rated load | 1 |
| Pulse energy in avalanche mode, non repetitive | ER | | | 20 | mJ | I(BR)R = 1 A, TJ = 25 °C | 1 |
| Operating junction and storage temperature range | TJ, TSTG | -55 | | 150 | °C | | 1 |
| Thermal resistance, junction to lead | RθJL | | | 25 | °C/W | TL = const. | 2 |
| Thermal resistance, junction to ambient | RθJA (1) | | | 150 | °C/W | Mounted on epoxy-glass hard tissue | 2 |
| Thermal resistance, junction to ambient | RθJA (2) | | | 125 | °C/W | Mounted on epoxy-glass hard tissue, 50 mm2 35 μm Cu | 2 |
| Thermal resistance, junction to ambient | RθJA (3) | | | 100 | °C/W | Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 μm Cu | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
## CAD (KiCad official)
- Symbol: `BYG22D`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA (KiCad packages3D, STEP)
- 3D model files: `byg22d-etched.step` / `byg22d-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `byg22d.step` / `byg22d.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [LGE datasheet](docs/byg22d-datasheet.pdf) (4 pp, sha256 `b2fc4f2b7bb00ccc`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/byg22d-datasheet.pdf)