component
BYG22B
Public Made by Adomby adom
LGE Avalanche Diodes, SMA. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownBYG22B
LGE · Avalanche Diodes · SMA
BYG22B from LGE, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | SMA |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum instantaneous forward voltage | VF | 1 | V | IF = 1.0 A, TJ = 25 °C | 2 | ||
| Maximum instantaneous forward voltage | VF | 1.1 | V | IF = 2.0 A | 2 | ||
| Maximum reverse current | IR | 1 | µA | VR = VRRM, TJ = 25 °C | 2 | ||
| Maximum reverse current | IR | 10 | µA | VR = VRRM, TJ = 100 °C | 2 | ||
| Maximum reverse recovery time | trr | 25 | ns | IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A | 2 | ||
| Maximum thermal resistance, junction to lead | RJL | 25 | °C/W | TL = const. | 2 | ||
| Maximum thermal resistance, junction to ambient | RJA (1) | 150 | °C/W | Mounted on epoxy-glass hard tissue | 2 | ||
| Maximum thermal resistance, junction to ambient | RJA (2) | 125 | °C/W | Mounted on epoxy-glass hard tissue, 50 mm2 35 μm Cu | 2 | ||
| Maximum thermal resistance, junction to ambient | RJA (3) | 100 | °C/W | Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 μm Cu | 2 | ||
| Maximum repetitive peak reverse voltage | VRRM | 100 | V | 1 | |||
| Average forward current | IF(AV) | 2 | A | 1 | |||
| Peak forward surge current | IFSM | 35 | A | 10 ms single half sine-wave superimposed on rated load | 1 | ||
| Pulse energy in avalanche mode, non repetitive | ER | 20 | mJ | Inductive load switch off; I(BR)R = 1 A, TJ = 25 °C | 1 | ||
| Operating junction and storage temperature range | TJ, TSTG | -55 | 150 | °C | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 | 1 |
CAD (KiCad official)
- Symbol:
BYG22B - Footprint:
Diode_SMD:D_SMA - 3D model: SMA (KiCad packages3D, STEP)
- 3D model files:
byg22b-etched.step/byg22b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);byg22b.step/byg22b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LGE datasheet (4 pp, sha256
4a326512242a7bd7, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).