component
BYG21M
Public Made by Adomby adom
LGE Diodes - Fast Recovery Rectifiers, DO-214AC(SMA). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBYG21M
LGE · Diodes - Fast Recovery Rectifiers · DO-214AC(SMA)
BYG21M from LGE, in a DO-214AC(SMA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal, marked by the cathode band on the molded body; the BYG21M blocks up to 1000 V DC (VRRM 1000 V). |
| 2 | A | passive | Anode terminal, opposite the cathode band; the BYG21M carries 1.5 A average forward current at TL=110 °C with VF of 1.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | DO-214AC(SMA) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM | 1000 | V | 1 | |||
| Maximum RMS Voltage | VRMS | 700 | V | 1 | |||
| Maximum DC Blocking Voltage | VDC | 1000 | V | 1 | |||
| Maximum Average Forward Rectified Current | I(AV) | 1.5 | A | @ TL=110 oC | 1 | ||
| Peak Forward Surge Current | IFSM | 30 | A | 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) | 1 | ||
| Maximum Instantaneous Forward Voltage | VF | 1.5 | V | @ 1.0A, @ 1.5A | 1 | ||
| Maximum DC Reverse Current | IR | 1 | uA | @ TJ=25 oC at rated DC blocking voltage | 1 | ||
| Maximum DC Reverse Current | IR | 100 | uA | @ TJ=125 oC at rated DC blocking voltage | 1 | ||
| Maximum Reverse Recovery Time | Trr | 120 | nS | IF=0.5A, IR=1.0A, IRR=0.25A | 1 | ||
| Thermal Resistance Junction to Ambient | RθJA | 150 | oC/W | P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad area | 1 | ||
| Thermal Resistance Junction to Lead | RθJL | 25 | oC/W | P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad area | 1 | ||
| Operating Temperature Range | TJ | -55 | 150 | °C | 1 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 1 | ||
| Typical Junction Capacitance | Cj | 10 | pF | Measured at 1 MHz and applied VR=4.0 Volts | 1 |
CAD (KiCad official)
- Symbol:
BYG21M - Footprint:
Diode_SMD:D_SMA - 3D model: DO-214AC(SMA) (KiCad packages3D, STEP)
- 3D model files:
byg21m-etched.step/byg21m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);byg21m.step/byg21m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: LGE datasheet (3 pp, sha256
cf20a25a4373dad7, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).