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BYG10Y-E3

Vishay Intertech · Avalanche Diodes · SMA(DO-214AC)

BYG10Y-E3 from Vishay Intertech, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Vishay Intertech
Package SMA(DO-214AC)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 1600 V 1
Average forward current IF(AV) 1.5 A 1
Peak forward surge current IFSM 30 A 10 ms single half sine-wave superimposed on rated load 1
Pulse energy in avalanche mode, non repetitive ER 20 mJ I(BR)R = 0.4 A, TJ = 25 °C (for BYG10Y) 1
Operating junction and storage temperature range TJ, TSTG -55 150 °C 1
Maximum instantaneous forward voltage VF 1.1 V IF = 1 A, TJ = 25 °C 2
Maximum instantaneous forward voltage VF 1.15 V IF = 1.5 A 2
Maximum DC reverse current IR 1 μA VR = VRRM, TJ = 25 °C 2
Maximum DC reverse current IR 10 μA VR = VRRM, TJ = 100 °C 2
Maximum reverse recovery time trr 4 μs IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 2
Typical thermal resistance, junction to lead RJL 25 °C/W 2
Typical thermal resistance, junction to ambient RJA (1) 150 °C/W Mounted on epoxy-glass hard tissue 2
Typical thermal resistance, junction to ambient RJA (2) 125 °C/W Mounted on epoxy-glass hard tissue, 50 mm2 35 μm Cu 2
Typical thermal resistance, junction to ambient RJA (3) 100 °C/W Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 μm Cu 2

CAD (KiCad official)

  • Symbol: BYG10Y-E3
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: byg10y-e3-etched.step / byg10y-e3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); byg10y-e3.step / byg10y-e3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Vishay Intertech datasheet (5 pp, sha256 633165271372fad3, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF