component

BYG10G

Public Made by Adom

by adom

LGE Avalanche Diodes, SMA. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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BYG10G

LGE · Avalanche Diodes · SMA

BYG10G from LGE, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer LGE
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 400 V TA = 25 °C 1
Average forward current IF(AV) 1.5 A TA = 25 °C 1
Peak forward surge current IFSM 30 A 10 ms single half sine-wave superimposed on rated load 1
Pulse energy in avalanche mode, non repetitive ER 20 mJ I(BR)R = 1 A, TJ = 25 °C (for BYG10D-BYG10M) 1
Operating junction and storage temperature range TJ, TSTG -55 150 °C 1
Maximum instantaneous forward voltage VF 1.1 V IF = 1 A, TJ = 25 °C 2
Maximum instantaneous forward voltage VF 1.15 V IF = 1.5 A, TJ = 25 °C 2
Maximum DC reverse current IR 1 µA VR = VRRM, TJ = 25 °C 2
Maximum DC reverse current IR 10 µA VR = VRRM, TJ = 100 °C 2
Maximum reverse recovery time trr 4 µs IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 2
Typical thermal resistance, junction to lead RθJL 25 °C/W 2
Typical thermal resistance, junction to ambient RθJA 150 °C/W (1) Mounted on epoxy-glass hard tissue 2
Typical thermal resistance, junction to ambient RθJA 125 °C/W (2) Mounted on epoxy-glass hard tissue, 50 mm2 35 µm Cu 2
Typical thermal resistance, junction to ambient RθJA 100 °C/W (3) Mounted on Al-oxide-ceramic (Al2O3), 50 mm2 35 µm Cu 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 1

CAD (KiCad official)

  • Symbol: BYG10G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: byg10g-etched.step / byg10g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); byg10g.step / byg10g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LGE datasheet (4 pp, sha256 790fdc4467720902, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF