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BY25Q40ALUIG

Public Made by Adom

by adom

BOYAMICRO NOR FLASH, USON-8-EP(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BY25Q40ALUIG

BOYAMICRO · NOR FLASH · USON-8-EP(2x3)

BY25Q40ALUIG from BOYAMICRO, in a USON-8-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Active-low chip select; when high the device is deselected, inputs are ignored and outputs are high impedance, and a falling edge is required after power-up before any instruction.
2 SO/IO1 bidirectional Serial data output for standard SPI shifting data out on the falling edge of SCLK, becoming IO1 in Dual or Quad SPI mode.
3 /WP/IO2 bidirectional Active-low write protect which, with SRP1 and SRP0 set to 0 and 1, blocks writes to the status registers; it has an internal pull-up and becomes IO2 in Quad SPI mode.
4 VSS power_in Ground, the reference for the VCC supply voltage.
5 SI/IO0 bidirectional Serial data input latched on the rising edge of SCLK for instructions, addresses and data, becoming IO0 in Dual or Quad SPI mode.
6 SCLK input Serial clock providing the synchronization reference; inputs are latched on the rising edge and outputs change after the falling edge.
7 /HOLD/IO3 bidirectional Active-low hold input that pauses serial transfer in standard or dual SPI mode without stopping an in-progress write, program or erase; it has an internal pull-up and becomes IO3 in Quad SPI mode.
8 VCC power_in Core and I/O power supply within the 1.65 V to 2.0 V range, which must be held stable during all operations.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer BOYAMICRO
Package USON-8-EP(2x3)
Category Memory
Pins 9

CAD (KiCad official)

  • Symbol: BY25Q40ALUIG
  • Footprint: Package_SON:SON-8-1EP_3x2mm_P0.5mm_EP1.4x1.6mm
  • 3D model: USON-8-EP(2x3) (KiCad packages3D, STEP)
  • 3D model files: by25q40aluig-etched.step / by25q40aluig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); by25q40aluig.step / by25q40aluig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOYAMICRO datasheet (75 pp, sha256 90ee112a48f59455, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF