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BY25Q32ESSIG

Public Made by Adom

by adom

BOYAMICRO NOR FLASH, SOP-8-208mil. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs by25q32essig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
viewers by25q32essig: viewers · Ray 1mo ago
by25q32essig-etched.fit.json by25q32essig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
by25q32essig-etched.glb by25q32essig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
by25q32essig-etched.step by25q32essig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 3d ago
by25q32essig.glb Publish 0.1.0 · Ray 1mo ago
by25q32essig.kicad_mod Publish 0.1.0 · Ray 1mo ago
by25q32essig.kicad_sym Publish 0.1.0 · Ray 1mo ago
by25q32essig.lbr Publish 0.1.0 · Ray 1mo ago
by25q32essig.step Publish 0.1.0 · Ray 1mo ago
package.json Publish 0.2.0 · Ray 1mo ago
page.json Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout") · Ray 12d ago
README.md by25q32essig: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 18d ago

BY25Q32ESSIG

BOYAMICRO · NOR FLASH · SOP-8-208mil

BY25Q32ESSIG from BOYAMICRO, in a SOP-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select, active-low. Enables the device when driven low, placing it in Active Power mode; when high the device is deselected, all inputs are ignored and outputs go high-impedance (Standby mode). A falling edge is required after power-up before the first instruction.
2 SO/IO1 bidirectional Serial Data Output in standard SPI (data shifted out on falling edge of SCLK). Becomes bidirectional IO1 during Dual and Quad SPI instructions.
3 /WP/IO2 bidirectional Write Protect, active-low, in standard/Dual SPI (used with SRP0/SRP1 to hardware-protect the Status Register and protected blocks). Becomes bidirectional IO2 in Quad SPI mode. Has internal pull-up; may be left unconnected if Quad mode not used.
4 VSS power_in Ground reference for the VCC supply.
5 SI/IO0 bidirectional Serial Data Input in standard SPI (data latched on rising edge of SCLK). Becomes bidirectional IO0 during Dual and Quad SPI instructions.
6 SCLK input Serial Clock. Provides the synchronization reference for the SPI interface. Instructions, addresses, and input data are latched on the rising edge; output data changes on the falling edge. Supports SPI mode 0 and mode 3.
7 /HOLD/IO3 bidirectional HOLD (active-low) pauses serial communications without deselecting the device when QE=0; can alternatively be configured as /RESET via Status Register. Becomes bidirectional IO3 in Quad SPI mode. Has internal pull-up; may be left unconnected if Quad mode not used.
8 VCC power_in Core and I/O power supply, 2.7 V to 3.6 V single-supply. Must be held stable within the specified range during all operations.

Key specifications

Parameter Value
Manufacturer BOYAMICRO
Package SOP-8-208mil
Category Memory
Pins 8

Ordering variants

  • BY25Q32ESSIG
  • BY25Q32ESSIGBY25Q32ESSJG
  • BY25Q32ESSIGBY25Q32ESSAG
  • BY25Q32ESSIGBY25Q32ESSIP
  • BY25Q32ESSIGBY25Q32ESSIE
  • BY25Q32ESSIGBY25Q32ESTIG
  • BY25Q32ESSIGBY25Q32ESTJG
  • BY25Q32ESSIGBY25Q32ESTAG
  • BY25Q32ESSIGBY25Q32ESHIG
  • BY25Q32ESSIGBY25Q32ESHJG
  • BY25Q32ESSIGBY25Q32ESHAG
  • BY25Q32ESSIGBY25Q32ESWIG
  • BY25Q32ESSIGBY25Q32ESWJG
  • BY25Q32ESSIGBY25Q32ESWAG
  • BY25Q32ESSIGBY25Q32ESMIG
  • BY25Q32ESSIGBY25Q32ESMJG
  • BY25Q32ESSIGBY25Q32ESMAG

CAD (KiCad official)

  • Symbol: BY25Q32ESSIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8-208mil (KiCad packages3D, STEP)
  • 3D model files: by25q32essig-etched.step / by25q32essig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); by25q32essig.step / by25q32essig.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
by25q32essig.step 122 KB You want the bare part, or you mark your own boards.
by25q32essig-etched.step 2.8 MB You want the part with BY25Q32ESSIG already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 670 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOYAMICRO datasheet (86 pp, sha256 55e80e53231fb096, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF