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BY25Q32BSTIG

Public Made by Adom

by adom

BOYAMICRO NOR FLASH, SOP-8-150mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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BY25Q32BSTIG

BOYAMICRO · NOR FLASH · SOP-8-150mil

BY25Q32BSTIG from BOYAMICRO, in a SOP-8-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select: when high the device is deselected, inputs are ignored and outputs are high impedance; driving it low enables the device, and a falling edge is required before any instruction after power-up.
2 SO (IO1) bidirectional Serial data output for single-bit instructions, shifting data out on the falling edge of SCK, and IO1 for Dual or Quad instructions.
3 /WP (IO2) bidirectional Write Protect in single-bit or Dual instructions (blocks Status Register writes when low with SRP1/SRP0 set to 0/1) and IO2 in Quad mode, with an internal pull-up so it may be left unconnected if Quad is not used.
4 VSS power_in Ground.
5 SI (IO0) bidirectional Serial data input for instructions, addresses and data to be programmed, latched on the rising edge of SCK, and IO0 for Dual or Quad instructions.
6 SCLK input Serial Clock input that synchronizes the SPI interface, with inputs latched on the rising edge and data output changing after the falling edge.
7 /HOLD (IO3) bidirectional Hold (pause) serial transfer in single-bit or Dual instructions when QE=0, and IO3 in Quad I/O mode when QE=1, with an internal pull-up so it may be left unconnected if Quad is not used.
8 VCC power_in Core and I/O power supply, 2.7 V to 3.6 V, which must be held stable within the valid range during all operations.

Key specifications

Parameter Value
Manufacturer BOYAMICRO
Package SOP-8-150mil
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Leakage Current ILI -2 2 µA T=-4085°C, VCC=2.73.6V 64
Output Leakage Current ILO -2 2 µA T=-4085°C, VCC=2.73.6V 64
Standby Current ICC1 13 25 µA /CS=VCC, VIN=VCC or VSS 64
Deep Power-Down Current ICC2 2 5 µA /CS=VCC, VIN=VCC or VSS 64
Operating Current (Read) 120MHz ICC3 15 20 mA SCLK=0.1VCC/0.9VCC, at 120MHz, Q=Open 64
Operating Current (Read) 80MHz ICC3 13 18 mA SCLK=0.1VCC/0.9VCC, at 80MHz, Q=Open 64
Operating Current (Page Program) ICC4 15 mA /CS=VCC 64
Operating Current (WRSR) ICC5 5 mA /CS=VCC 64
Operating Current (Sector Erase) ICC6 20 mA /CS=VCC 64
Operating Current (Block Erase) ICC7 20 mA /CS=VCC 64
Operating Current (Chip Erase) ICC8 20 mA /CS=VCC 64
Input Low Voltage VIL -0.5 V max printed as 0.2VCC 64
Output Low Voltage VOL 0.4 V IOL=100µA 64
Supply Voltage VCC -0.5 4 V 62
Voltage Applied to Any Pin VIO -0.5 4 V Relative to Ground 62
Storage Temperature TSTG -65 150 °C 62
Electrostatic Discharge Voltage VESD -2000 2000 V Human Body Model 62
Supply Voltage VCC 2.7 3.6 V 62
Operating Temperature (Industrial) TA -40 85 °C Industrial 62
VCC(min) to /CS Low tVSL 300 us 63
Clock frequency (all except 03H) Fc 108 MHz T=-4085°C, VCC=2.73.6V 66
Clock freq. Read Data (03H) fR 55 MHz 66
Serial Clock High Time tCLH 4 ns 66
Serial Clock Low Time tCLL 4 ns 66
/CS Active Setup Time tSLCH 5 ns 66
/CS Active Hold Time tCHSH 5 ns 66
/CS High Time (read/write) tSHSL 20 ns 66
Output Disable Time tSHQZ 6 ns 66
Output Hold Time tCLQX 0 ns 66
Data In Setup Time tDVCH 2 ns 66
Data In Hold Time tCHDX 2 ns 66
Clock Low To Output Valid tCLQV 7 ns 67
Write Protect Setup Time Before /CS Low tWHSL 20 ns 67
Write Protect Hold Time After /CS High tSHWL 100 ns 67
/CS High To Deep Power-Down Mode tDP 20 µs 67
/CS High To Standby Mode Without Electronic Signature Read tRES1 2 µs 67
/CS High To Standby Mode With Electronic Signature Read tRES2 2 µs 67
/CS High To Next Instruction After Suspend tSUS 20 µs 67
Write Status Register Cycle Time tW 5 30 ms 67
Byte Program Time (First Byte) tBP1 30 50 µs 67
Additional Byte Program Time tBP2 2.5 12 µs After first byte 67
Page Programming Time tPP 0.6 2.4 ms 67
Sector Erase Time tSE 50 300 ms 67
Chip Erase Time tCE 15 30 S 67

CAD (KiCad official)

  • Symbol: BY25Q32BSTIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8-150mil (KiCad packages3D, STEP)
  • 3D model files: by25q32bstig-etched.step / by25q32bstig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); by25q32bstig.step / by25q32bstig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOYAMICRO datasheet (78 pp, sha256 e248f34bd3350ce7, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF