component

BY25Q128ASSIG

Public Made by Adom

by adom

BOYAMICRO NOR FLASH, SOP-8-208mil. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs by25q128assig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
by25q128assig-etched.fit.json by25q128assig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
by25q128assig-etched.glb by25q128assig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
by25q128assig-etched.step by25q128assig: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
by25q128assig.glb Publish 0.1.0 · Ray
by25q128assig.kicad_mod Publish 0.1.0 · Ray
by25q128assig.kicad_sym Publish 0.1.0 · Ray
by25q128assig.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
by25q128assig.step Publish 0.1.0 · Ray
package.json by25q128assig: manufacturer 'BOYAMICRO' (was 'BOYAMICRO BY25Q128ASSIG R': the MPN had been folded in) · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json by25q128assig: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray
README.md by25q128assig: manufacturer 'BOYAMICRO' (was 'BOYAMICRO BY25Q128ASSIG R': the MPN had been folded in) · Ray

BY25Q128ASSIG

BOYAMICRO · NOR FLASH · SOP-8-208mil

BY25Q128ASSIG from BOYAMICRO, in a SOP-8-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select, active-low. Drive low to enable the device and start an SPI transaction; drive high to place the device in Standby and put all outputs into high impedance.
2 SO/IO1 bidirectional Serial Data Output for Standard SPI (data shifted out on falling edge of SCLK). Becomes bidirectional IO1 during Dual/Quad Instructions.
3 /WP/IO2 bidirectional Write Protect, active-low, prevents status register writes and hardware-protects memory when SRP1/SRP0 configured accordingly. Has internal pull-up; may be left unconnected if not used. Becomes IO2 in Quad SPI mode.
4 VSS power_in Ground reference for the VCC supply.
5 SI/IO0 bidirectional Serial Data Input for Standard SPI; receives instructions, addresses, and program data latched on the rising edge of SCLK. Becomes bidirectional IO0 during Dual/Quad Instructions.
6 SCLK input Serial Clock input providing the synchronization reference for the SPI interface. Instructions, addresses, and input data are latched on the rising edge; output data changes on the falling edge.
7 /HOLD/IO3 bidirectional Hold, active-low, pauses serial communication with the device without terminating an in-progress write/program/erase. Has internal pull-up; may be left unconnected if not used. Becomes IO3 in Quad-I/O mode.
8 VCC power_in Core and I/O power supply. Single 2.7 V to 3.6 V supply used for all read, program, and erase operations. Must remain within VCC(min)-VCC(max) during all operations.

Key specifications

Parameter Value
Manufacturer BOYAMICRO
Package SOP-8-208mil
Category Memory
Pins 8

Ordering variants

  • BY25Q128ASSIG
  • BY25Q128ASSIGPIG
  • BY25Q128ASSIGPI
  • BY25Q128ASSIGZSIG
  • BY25Q128ASSIGZS
  • BY25Q128ASSIGVSIG
  • BY25Q128ASSIGVS
  • BY25Q128ASSIGUSIG
  • BY25Q128ASSIGUS
  • BY25Q128ASSIGXSIG
  • BY25Q128ASSIGXS
  • BY25Q128ASSIGFSIG
  • BY25Q128ASSIGFS

CAD (KiCad official)

  • Symbol: BY25Q128ASSIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8-208mil (KiCad packages3D, STEP)
  • 3D model files: by25q128assig-etched.step / by25q128assig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); by25q128assig.step / by25q128assig.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
by25q128assig.step 122 KB You want the bare part, or you mark your own boards.
by25q128assig-etched.step 2.9 MB You want the part with BY25Q128ASSIG already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 702 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOYAMICRO datasheet (77 pp, sha256 65bba7895d2ef403, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF