by25d80astig: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding)
Brief states the pinout check that actually ran (was an unconditional "Datasheet-verified pinout")
by25d80astig: manufacturer 'BOYAMICRO' (was 'BOYAMICRO BY25D80ASTIG R': the MPN had been folded in)
by25d80astig: laser-etched CAD + chip hero (factory 2.0.0 backfill)
by25d80astig: backfill missing artifacts (mfr, variants)
by25d80astig: publish the laser-etched STEP alongside the bare one
by25d80astig: factory component page (tier=lcsc)
Initial commit: component/by25d80astig