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BY25D16ASSIG

BOYAMICRO · NOR FLASH · SOP-8

BY25D16ASSIG from BOYAMICRO, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 /CS input Chip Select input that enables the device for SPI operation.
2 SO (IO1) bidirectional Serial Output for single bit data instructions, and IO1 for Dual instructions.
3 /WP (IO2) input Write Protect input in single bit mode, used for hardware write protection.
4 VSS power_in Ground.
5 SI (IO0) bidirectional Serial Input for single bit data instructions, and IO0 for Dual instructions.
6 SCLK input Serial Clock input.
7 NC unconnected No connection.
8 VCC power_in Core and I/O power supply, 2.7 V to 3.6 V, which must be held stable within the valid range during all operations.

Key specifications

Parameter Value
Manufacturer BOYAMICRO
Package SOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.5 4 V 30
Voltage Applied to Any Pin VIO -0.5 4 V Relative to Ground 30
Storage Temperature TSTG -65 150 °C 30
Electrostatic Discharge Voltage VESD -2000 2000 V Human Body Model 30
Supply Voltage VCC 2.7 3.6 V 30
Operating Temperature Commercial TA 0 70 °C Commercial 30
Operating Temperature Industrial TA -40 85 °C Industrial 30
Input Leakage Current ILI -2 2 µA 32
Output Leakage Current ILO -2 2 µA 32
Standby Current ICC1 13 25 µA /CS=VCC, VIN=VCC or VSS 32
Deep Power-Down Current ICC2 2 5 µA /CS=VCC, VIN=VCC or VSS 32
Operation Current (Read) ICC3 13 18 mA SCLK=0.1VCC/0.9VCC at 80MHz, Q=Open (*1,*2,*4 I/O) 32
Operating Current (PP) ICC4 15 mA /CS=VCC 32
Operating Current (WRSR) ICC5 5 mA /CS=VCC 32
Operating Current (Sector Erase) ICC6 20 mA /CS=VCC 32
Operating Current (Block Erase) ICC7 20 mA /CS=VCC 32
Operating Current (Chip Erase) ICC8 20 mA /CS=VCC 32
Output Low Voltage VOL 0.4 V IOL =100µA 32
VCC(min) To /CS Low tVSL 300 us 31
Clock frequency, all instructions except Read Data (03H) fc 108 MHz 33
Clock frequency, Read Data (03H) fR 55 MHz 33
Serial Clock High Time tCLH 4 ns 33
Serial Clock Low Time tCLL 4 ns 33
/CS High Time (read/write) tSHSL 20 ns 34
Output Disable Time tSHQZ 6 ns 34
Clock Low To Output Valid tCLQV 7 ns 34
/CS High To Deep Power-Down Mode tDP 0.1 µs 34
Write Status Register Cycle Time tW 2 15 ms 34
Page Programming Time tPP 0.7 2.4 ms 34
Sector Erase Time tSE 100 300 ms 34
Chip Erase Time tCE 15 35 s 34

CAD (KiCad official)

  • Symbol: BY25D16ASSIG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: by25d16assig-etched.step / by25d16assig-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); by25d16assig.step / by25d16assig.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BOYAMICRO datasheet (44 pp, sha256 37793678dd834002, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF