component
BU7150NUV-E2
Public Made by Adomby adom
ROHM Semicon Audio Power OpAmps, VSON-10-EP(3x3). Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBU7150NUV-E2
ROHM Semicon · Audio Power OpAmps · VSON-10-EP(3x3)
BU7150NUV-E2 from ROHM Semicon, in a VSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN1 | input | Audio Input Pin 1 (channel 1). AC-coupled via CI1 (0.47µF) with input resistor RI1 (20kΩ) to the inverting op-amp input. |
| 2 | SDB | input | Shutdown control input (active low). Device is in shutdown/OFF when SDB is at logic low. VIH ≥ 0.7 V, VIL ≤ 0.3 V. |
| 3 | MUTEB | input | Mute control input (active low). Outputs are muted when MUTEB is at logic low. In BTL mode, MUTEB=VSS behaves as shutdown. VIH ≥ 0.7 V, VIL ≤ 0.3 V. |
| 4 | BYPASS | passive | Internal bias-reference bypass pin. Requires an external CBYPASS decoupling capacitor (typ. 4.7µF) to VSS for PSRR performance. |
| 5 | IN2 | input | Audio Input Pin 2 (channel 2). AC-coupled via CI2 (0.47µF) with input resistor RI2 (20kΩ) to the second op-amp's inverting input. |
| 6 | VSS | power_in | Ground reference / GND pin. |
| 7 | OUT2 | output | Audio output pin 2. Drives right-channel headphone in single-ended mode (through 100µF DC-blocking cap + 10Ω Zobel network) or forms one leg of the BTL speaker output. |
| 8 | MODE | input | Operating mode select. Tie to VSS for single-ended stereo (SE) mode; tie to VDD for BTL mono speaker mode. |
| 9 | OUT1 | output | Audio output pin 1. Drives left-channel headphone in single-ended mode (through 100µF DC-blocking cap + 10Ω Zobel network) or the other leg of the BTL speaker output. |
| 10 | VDD | power_in | Positive supply pin. Operating range 0.93-3.5 V (>1.03 V down to −40 °C); absolute maximum 4.5 V. Decouple with 10µF + 0.1µF to VSS. |
| 11 | EP | passive | Exposed thermal pad on package bottom. Solder to the VSS/ground copper for thermal dissipation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ROHM Semicon |
| Package | VSON-10-EP(3x3) |
| Category | Operational Amplifier/Comparator |
| Pins | 11 |
Ordering variants
Same part, different packaging or reel option.
BU7150NUV-E2
CAD (KiCad official)
- Symbol:
BU7150NUV-E2 - Footprint:
Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm - 3D model: VSON-10-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
bu7150nuv-e2-etched.step/bu7150nuv-e2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bu7150nuv-e2.step/bu7150nuv-e2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ROHM Semicon datasheet (21 pp, sha256
51b02e6865545d6f, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).