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Contents

README

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BU7150NUV-E2

ROHM Semicon · Audio Power OpAmps · VSON-10-EP(3x3)

BU7150NUV-E2 from ROHM Semicon, in a VSON-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN1 input Audio Input Pin 1 (channel 1). AC-coupled via CI1 (0.47µF) with input resistor RI1 (20kΩ) to the inverting op-amp input.
2 SDB input Shutdown control input (active low). Device is in shutdown/OFF when SDB is at logic low. VIH ≥ 0.7 V, VIL ≤ 0.3 V.
3 MUTEB input Mute control input (active low). Outputs are muted when MUTEB is at logic low. In BTL mode, MUTEB=VSS behaves as shutdown. VIH ≥ 0.7 V, VIL ≤ 0.3 V.
4 BYPASS passive Internal bias-reference bypass pin. Requires an external CBYPASS decoupling capacitor (typ. 4.7µF) to VSS for PSRR performance.
5 IN2 input Audio Input Pin 2 (channel 2). AC-coupled via CI2 (0.47µF) with input resistor RI2 (20kΩ) to the second op-amp's inverting input.
6 VSS power_in Ground reference / GND pin.
7 OUT2 output Audio output pin 2. Drives right-channel headphone in single-ended mode (through 100µF DC-blocking cap + 10Ω Zobel network) or forms one leg of the BTL speaker output.
8 MODE input Operating mode select. Tie to VSS for single-ended stereo (SE) mode; tie to VDD for BTL mono speaker mode.
9 OUT1 output Audio output pin 1. Drives left-channel headphone in single-ended mode (through 100µF DC-blocking cap + 10Ω Zobel network) or the other leg of the BTL speaker output.
10 VDD power_in Positive supply pin. Operating range 0.93-3.5 V (>1.03 V down to −40 °C); absolute maximum 4.5 V. Decouple with 10µF + 0.1µF to VSS.
11 EP passive Exposed thermal pad on package bottom. Solder to the VSS/ground copper for thermal dissipation.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package VSON-10-EP(3x3)
Category Operational Amplifier/Comparator
Pins 11

Ordering variants

Same part, different packaging or reel option.

  • BU7150NUV-E2

CAD (KiCad official)

  • Symbol: BU7150NUV-E2
  • Footprint: Package_SON:VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm
  • 3D model: VSON-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: bu7150nuv-e2-etched.step / bu7150nuv-e2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bu7150nuv-e2.step / bu7150nuv-e2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (21 pp, sha256 51b02e6865545d6f, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF