component
BST82
Public Made by Adomby adom
Nexperia MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownBST82
Nexperia · MOSFETs · SOT-23
BST82 from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel TrenchMOS MOSFET; the datasheet's limiting values give a gate-source voltage of ±20 V DC (Table 3). |
| 2 | S | passive | Source of the N-channel MOSFET; the source-drain diode forward current IS is limited to 190 mA DC at Tsp = 25 °C (Table 3). |
| 3 | D | passive | Drain of the N-channel MOSFET; the datasheet limits VDS to 100 V DC (Tj = 25 to 150 °C) and ID to 190 mA DC at Tsp = 25 °C with VGS = 5 V (Table 3). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage (DC) | VDS | 100 | V | Tj = 25 to 150 °C | 3 | ||
| Drain-gate voltage (DC) | VDGR | 100 | V | Tj = 25 to 150 °C; RGS = 20 kΩ | 3 | ||
| Gate-source voltage (DC) | VGS | -20 | 20 | V | 3 | ||
| Drain current (DC) | ID | 190 | mA | Tsp = 25 °C; VGS = 5 V; Figure 2 and 3 | 3 | ||
| Drain current (DC) | ID | 120 | mA | Tsp = 100 °C; VGS = 5 V; Figure 2 | 3 | ||
| Peak drain current | IDM | 0.8 | A | Tsp = 25 °C; pulsed; tp ≤ 10 µs; Figure 3 | 3 | ||
| Total power dissipation | Ptot | 0.83 | W | Tsp = 25 °C; Figure 1 | 3 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 3 | ||
| Operating junction temperature | Tj | -65 | 150 | °C | 3 | ||
| Source (diode forward) current (DC) | IS | 190 | mA | Tsp = 25 °C | 3 | ||
| Peak source (diode forward) current | ISM | 0.8 | A | Tsp = 25 °C; pulsed; tp ≤ 10 µs | 3 | ||
| Drain-source breakdown voltage | V(BR)DSS | 100 | 130 | V | ID = 10 µA; VGS = 0 V; Tj = 25 °C | 6 | |
| Drain-source breakdown voltage | V(BR)DSS | 89 | V | ID = 10 µA; VGS = 0 V; Tj = −55 °C | 6 | ||
| Gate-source threshold voltage | VGS(th) | 0.6 | V | ID = 1 mA; VDS = VGS; Figure 9; Tj = 150 °C | 6 | ||
| Gate-source threshold voltage | VGS(th) | 3.5 | V | ID = 1 mA; VDS = VGS; Figure 9; Tj = −55 °C | 6 | ||
| Drain-source leakage current | IDSS | 0.01 | 1 | µA | VDS = 60 V; VGS = 0 V; Tj = 25 °C | 6 | |
| Drain-source leakage current | IDSS | 10 | µA | VDS = 60 V; VGS = 0 V; Tj = 150 °C | 6 | ||
| Gate-source leakage current | IGSS | 10 | 100 | nA | VGS = ±20 V; VDS = 0 V | 6 | |
| Drain-source on-state resistance | RDSon | 5 | 10 | Ω | VGS = 5 V; ID = 150 mA; Figure 7 and 8; Tj = 25 °C | 6 | |
| Drain-source on-state resistance | RDSon | 23 | Ω | VGS = 5 V; ID = 150 mA; Figure 7 and 8; Tj = 150 °C | 6 | ||
| Input capacitance | Ciss | 25 | 40 | pF | VGS = 0 V; VDS = 10 V; f = 1 MHz; Figure 12 | 6 | |
| Output capacitance | Coss | 8.5 | 15 | pF | VGS = 0 V; VDS = 10 V; f = 1 MHz; Figure 12 | 6 | |
| Reverse transfer capacitance | Crss | 5 | 10 | pF | VGS = 0 V; VDS = 10 V; f = 1 MHz; Figure 12 | 6 | |
| Turn-on time | ton | 3 | 10 | ns | VDD = 50 V; RD = 250 Ω; VGS = 10 V; RG = 50 Ω; RGS = 50 Ω | 6 | |
| Turn-off time | toff | 12 | 15 | ns | VDD = 50 V; RD = 250 Ω; VGS = 10 V; RG = 50 Ω; RGS = 50 Ω | 6 | |
| Source-drain (diode forward) voltage | VSD | 0.95 | 1.5 | V | IS = 300 mA; VGS = 0 V; Figure 13 | 6 | |
| Thermal resistance from junction to solder point | Rth(j-sp) | 150 | K/W | Mounted on a metal clad substrate; Figure 4 | 5 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 350 | K/W | Mounted on a printed circuit board; minimum footprint | 5 |
CAD (KiCad official)
- Symbol:
BST82 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
bst82-etched.step/bst82-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bst82.step/bst82.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (14 pp, sha256
b9719d15e7f7710e, retrieved 2026-10-17, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).