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Ray Publish 0.1.0 db4efa8 16d ago

BST236A242U

BORN · ESD And Surge Protection (TVS/ESD) · SOT-23-6

BST236A242U from BORN, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O passive Protected data line I/O, steered to GND/VCC by the diode array, with 2.5pF typ. capacitance IO to GND and 1.0pF typ. IO to IO.
2 GND power_in Ground reference pin of the TVS diode, connected to the central avalanche diode.
3 I/O passive Protected data line I/O, steered to GND/VCC by the diode array, with 2.5pF typ. capacitance IO to GND and 1.0pF typ. IO to IO.
4 VCC power_in Supply/power line connection of the diode array, reverse stand-off voltage VRWM 24V max, tied internally with pins 5 and 6.
5 VCC power_in Supply/power line connection of the diode array, reverse stand-off voltage VRWM 24V max, tied internally with pins 4 and 6.
6 VCC power_in Supply/power line connection of the diode array, reverse stand-off voltage VRWM 24V max, tied internally with pins 4 and 5.

Key specifications

Parameter Value
Manufacturer BORN
Package SOT-23-6
Category Circuit Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power PPP 1125 Watts tp =8/20μs 2
Peak Pulse Current IPP 25 A tp =8/20μs 2
ESD per IEC 61000-4-2 (Air) VESD 30 KV IEC 61000-4-2 (Air) 2
ESD per IEC 61000-4-2 (Contact) VESD 30 KV IEC 61000-4-2 (Contact) 2
Lead Soldering Temperature TL 260 ◦C 10 seconds 2
Junction Temperature TJ -55 150 ◦C 2
Storage Temperature Tstg -55 150 ◦C 2
Reverse Stand-Off Voltage VRWM 24 V 2
Reverse Breakdown Voltage VBR 26 29 31 V IT=1mA 2
Reverse Leakage Current IR 0.05 0.5 uA VRWM=24V,T=25◦C 2
Peak Pulse Current IPP 25 A tp =8/20us 2
Clamping Voltage VC 36 45 V IPP=25A, tp =8/20us 2
Junction Capacitance (IO to GND) Cj 2.5 3 pF VR=0V,f=1MHZ,IO to GND 2

CAD (KiCad official)

  • Symbol: BST236A242U
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: bst236a242u-etched.step / bst236a242u-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bst236a242u.step / bst236a242u.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (4 pp, sha256 37e8934bf624b96a, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF