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BSS670S2L H6327

Infineon Technologies · MOSFETs · SOT-23

BSS670S2L H6327 from Infineon Technologies, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the N-channel enhancement-mode MOSFET, rated for a gate source voltage VGS of ±20 V.
2 Source passive Source terminal, the reference for the gate source voltage VGS and the drain current ID.
3 Drain passive Drain terminal, rated for a continuous drain current ID of 0.54 A at TA=25°C, and the pin at which the junction-to-soldering-point thermal resistance RthJS (290 K/W max) is specified.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-23
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current ID 0.54 A TA=25°C 1
Continuous drain current ID 0.43 A TA=70°C 1
Pulsed drain current ID puls 2.2 A TA=25°C 1
Gate source voltage VGS -20 20 V 1
Power dissipation Ptot 0.36 W TA=25°C 1
Operating and storage temperature Tj, Tstg -55 150 °C 1
Avalanche energy, single pulse EAS 8.1 mJ ID = 0.54 A, RG = 25 Ω 1
Thermal resistance, junction - soldering point (Pin 3) RthJS 290 K/W 2
Thermal resistance, junction - ambient, SMD version RthJA 350 K/W @ min. footprint 2
Thermal resistance, junction - ambient, SMD version RthJA 300 K/W @ 6 cm2 cooling area 2
Drain-source breakdown voltage V(BR)DSS 55 V VGS=0, ID=1mA 2
Gate threshold voltage VGS(th) 1.2 1.6 2 V VGS = VDS, ID=2.7µA 2
Zero gate voltage drain current IDSS 0.01 1 µA VDS=55V, VGS=0, Tj=25°C 2
Zero gate voltage drain current IDSS 0.1 10 µA VDS=55V, VGS=0, Tj=150°C 2
Gate-source leakage current IGSS 1 100 nA VGS=20V, VDS=0V 2
Drain-source on-state resistance RDS(on) 430 825 mΩ VGS=4.5V, ID=270mA 2
Drain-source on-state resistance RDS(on) 346 650 mΩ VGS=10V, ID=270mA 2
Transconductance gfs 0.6 1.2 S VDS≥2IDRDS(on)max, ID=0.54A 3
Input capacitance Ciss 56 75 pF VGS=0, VDS=25V, f=1MHz 3
Output capacitance Coss 13 18 pF VGS=0, VDS=25V, f=1MHz 3
Reverse transfer capacitance Crss 7 10 pF VGS=0, VDS=25V, f=1MHz 3
Turn-on delay time td(on) 9 14 ns VDD=30V, VGS=4.5V, ID=0.54A, RG=130Ω 3
Rise time tr 25 37 ns VDD=30V, VGS=4.5V, ID=0.54A, RG=130Ω 3
Turn-off delay time td(off) 21 31 ns VDD=30V, VGS=4.5V, ID=0.54A, RG=130Ω 3
Fall time tf 24 32 ns VDD=30V, VGS=4.5V, ID=0.54A, RG=130Ω 3
Gate to source charge Qgs 0.19 0.25 nC VDD=40V, ID=0.54A 3
Gate to drain charge Qgd 0.57 0.86 nC VDD=40V, ID=0.54A 3
Gate charge total Qg 1.7 2.26 nC VDD=40V, ID=0.54A, VGS=0 to 10V 3
Inverse diode continuous forward current IS 0.38 A TA=25°C 3
Inverse diode direct current, pulsed ISM 2.2 A 3
Inverse diode forward voltage VSD 0.8 1.1 V VGS=0, IF=0.54A 3
Reverse recovery time trr 51 64 ns VR=30V, IF=lS, diF/dt=100A/µs 3
Reverse recovery charge Qrr 22 28 nC VR=30V, IF=lS, diF/dt=100A/µs 3
Gate plateau voltage V(plateau) 3.1 V VDD=40V, ID=0.54A 3

CAD (KiCad official)

  • Symbol: BSS670S2L H6327
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bss670s2l-h6327-etched.step / bss670s2l-h6327-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bss670s2l-h6327.step / bss670s2l-h6327.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (8 pp, sha256 c760d8e924a8b859, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF