component
BSS169-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SOT-23(TO-236). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
BSS169-VB
VBsemi Elec · MOSFETs · SOT-23(TO-236)
BSS169-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, with threshold VGS(th) of 1.2 V min to 2.8 V max at ID = 250 µA. |
| 2 | S | passive | Source; continuous source-drain diode current is 2.1 A at TC = 25 °C. |
| 3 | D | passive | Drain; drain-source voltage rated 100 V with continuous drain current of 2 A at TC = 25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23(TO-236) |
| Category | Transistors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 100 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 2 | A | TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | 1.8 | A | TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | 1.6 | A | Tb, A = 25 °C | 1 | ||
| Continuous Drain Current | ID | 1.3 | A | Tb, A = 70 °C | 1 | ||
| Pulsed Drain Current | IDM | 7 | A | t = 300 µs | 1 | ||
| Continuous Source-Drain Diode Current | IS | 2.1 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | 1 | A | Tb, A = 25 °C | 1 | ||
| Single Pulse Avalanche Current | IAS | 5 | A | L = 0.1 mH | 1 | ||
| Single Pulse Avalanche Energy | EAS | 1.25 | mJ | 1 | |||
| Maximum Power Dissipation | PD | 2.5 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.6 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 1.25 | W | Tb, A = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 0.8 | W | Tb, A = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 75 | 100 | °C/W | t = 5 s | 1 | |
| Maximum Junction-to-Ambient (steady state, from note d) | RthJA | 166 | °C/W | Steady state | 1 | ||
| Maximum Junction-to-Foot (Drain) Steady State | RthJF | 40 | 50 | °C/W | Steady state | 1 | |
| Drain-Source Breakdown Voltage | VDS | 100 | V | VDS = 0 V, ID = 250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | 1.2 | 2.8 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 100 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS = 100 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | 5 | A | VDS 5 V, VGS = 4.5 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.24 | 0.25 | Ω | VGS = 10 V, ID = 1.5 A | 2 | |
| Forward Transconductance | gfs | 2 | S | VDS = 20 V, ID = 1.5 A | 2 | ||
| Gate Resistance | Rg | 0.3 | 1.4 | 2.8 | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time (VGEN = 4.5 V) | td(on) | 30 | 45 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Rise Time (VGEN = 4.5 V) | tr | 26 | 39 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time (VGEN = 4.5 V) | td(off) | 17 | 26 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Fall Time (VGEN = 4.5 V) | tf | 12 | 20 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Turn-On Delay Time (VGEN = 10 V) | td(on) | 6 | 12 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Rise Time (VGEN = 10 V) | tr | 10 | 20 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time (VGEN = 10 V) | td(off) | 10 | 20 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Fall Time (VGEN = 10 V) | tf | 6 | 12 | ns | VDD = 50 V, RL = 39 Ω, ID = 1.3 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Continuous Source-Drain Diode Current | IS | 2.1 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | 20 | A | 2 | |||
| Body Diode Voltage | VSD | 0.8 | 1.2 | V | IS = 1.3 A | 2 | |
| Body Diode Reverse Recovery Time | trr | 22 | 33 | ns | IF = 1.3 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 21 | 32 | nC | IF = 1.3 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Total Gate Charge | Qg | 5.2 | 10.4 | nC | VDS = 50 V, VGS = 10 V, ID = 1.6 A | 2 | |
| Total Gate Charge | Qg | 2.9 | 5.8 | nC | VDS = 50 V, VGS = 4.5 V, ID = 1.6 A | 2 | |
| VDS Temperature Coefficient | VDS/TJ | 105 | mV/°C | ID = 250 µA | 2 | ||
| VGS(th) Temperature Coefficient | VGS(th)/TJ | -5.2 | mV/°C | 2 | |||
| Input Capacitance | Ciss | 190 | pF | VDS = 50 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 22 | pF | VDS = 50 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 13 | pF | VDS = 50 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Gate-Source Charge | Qgs | 0.75 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 1.4 | nC | 2 | |||
| Reverse Recovery Fall Time | ta | 16 | ns | 2 | |||
| Reverse Recovery Rise Time | tb | 6 | ns | 2 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
BSS169-VB - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23(TO-236), generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
bss169-vb-etched.step/bss169-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bss169-vb.step/bss169-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (9 pp, sha256
e1c9311cbbfe8f29, retrieved 2026-11-13, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).