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BSS138NH6433

Infineon Technologies · MOSFETs · SOT-23-3

BSS138NH6433 from Infineon Technologies, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate pin of the N-channel enhancement-mode MOSFET, with a maximum gate-source voltage of ±20 V and a gate threshold of 0.6 to 1.4 V.
2 S passive Source pin of the MOSFET, carrying up to 0.23 A continuous drain current at TA=25 °C.
3 D passive Drain pin of the MOSFET, rated for 60 V drain-source voltage, 0.23 A continuous current and 0.92 A pulsed current.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-23-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage V(BR)DSS 60 V VGS= 0 V, ID=250 µA 2
Gate threshold voltage VGS(th) 0.6 1 1.4 V VGS=VDS, ID=26 µA 2
Drain-source leakage current, Tj=25 °C I D (off) 0.1 µA VDS=60 V, VGS=0 V, Tj=25 °C 2
Drain-source leakage current, Tj=150 °C I D (off) 5 µA VDS=60 V, VGS=0 V, Tj=150 °C 2
Gate-source leakage current I GSS 1 10 nA VGS=20 V, VDS=0 V 2
Drain-source on-state resistance R DS(on) 3.3 4 Ω VGS=4.5 V, ID=0.03 A 2
Drain-source on-state resistance R DS(on) 3.5 6 Ω VGS=4.5 V, ID=0.19 A 2
Drain-source on-state resistance R DS(on) 2.2 3.5 Ω VGS=10 V, ID=0.23 A 2
Transconductance g fs 0.1 0.2 S /VDS/>2/ID/RDS(on)max, ID=0.18 A 2
Input capacitance C iss 32 41 pF VGS=0 V, VDS=25 V, f=1 MHz 3
Output capacitance C oss 7.2 9.5 pF VGS=0 V, VDS=25 V, f=1 MHz 3
Reverse transfer capacitance C rss 2.8 3.8 pF VGS=0 V, VDS=25 V, f=1 MHz 3
Turn-on delay time t d(on) 2.3 3.5 ns VDD=30 V, VGS=10 V, ID=0.23 A, RG=6 Ω 3
Rise time t r 3 4.5 ns VDD=30 V, VGS=10 V, ID=0.23 A, RG=6 Ω 3
Turn-off delay time t d(off) 6.7 10 ns VDD=30 V, VGS=10 V, ID=0.23 A, RG=6 Ω 3
Fall time t f 8.2 12.3 ns VDD=30 V, VGS=10 V, ID=0.23 A, RG=6 Ω 3
Gate to source charge Q gs 0.1 0.14 nC VDD=48 V, ID=0.23 A, VGS=0 to 10 V 3
Gate to drain charge Q gd 0.3 0.4 nC VDD=48 V, ID=0.23 A, VGS=0 to 10 V 3
Gate charge total Q g 1 1.4 nC VDD=48 V, ID=0.23 A, VGS=0 to 10 V 3
Diode continuous forward current I S 0.23 A 3
Diode pulse current I S,pulse 0.92 A 3
Diode forward voltage VSD 0.83 1.2 V VGS=0 V, IF=0.23 A, Tj=25 °C 3
Reverse recovery time t rr 9.1 14.5 ns VR=30 V, IF=0.23 A, diF/dt=100 A/µs, TA=25 °C 3
Reverse recovery charge Q rr 3.3 5 nC VR=30 V, IF=0.23 A, diF/dt=100 A/µs, TA=25 °C 3
Continuous drain current, TA=25 °C I D 0.23 A TA=25 °C 1
Continuous drain current, TA=70 °C I D 0.18 A TA=70 °C 1
Pulsed drain current I D,pulse 0.92 A TA=25 °C 1
Reverse diode dv/dt dv/dt 6 kV/µs ID=0.23 A, VDS=48 V, di/dt=200 A/µs, Tj,max=150 °C 1
Gate source voltage VGS -20 20 V 1
Power dissipation Ptot 0.36 W TA=25 °C 1
Operating and storage temperature Tj, Tstg -55 150 °C 1
Thermal resistance, junction - minimal footprint R thJA 350 K/W junction - minimal footprint 2

CAD (KiCad official)

  • Symbol: BSS138NH6433
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: bss138nh6433-etched.step / bss138nh6433-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bss138nh6433.step / bss138nh6433.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (9 pp, sha256 7bfa04fa9f7d97fd, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF