component
BSS138NH6327-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
Ray
Publish 0.1.0
102ad46
BSS138NH6327-VB
VBsemi Elec · MOSFETs · SOT-23
BSS138NH6327-VB from VBsemi Elec, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; drives the N-channel MOSFET with a maximum gate-source voltage of ±20 V and a typical threshold of 2 V. |
| 2 | S | passive | Source terminal of the N-channel MOSFET, with continuous drain current up to 250 mA at TA = 25 °C. |
| 3 | D | passive | Drain terminal; the drain-source voltage is rated at 60 V and pulsed drain current at 800 mA. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | 60 | V | VGS = 0 V, ID = 10 µA | 2 | ||
| Gate-Threshold Voltage | VGS(th) | 1 | 2.5 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Body Leakage | IGSS | -10 | 10 | µA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Gate-Body Leakage | IGSS | 1 | µA | VDS = 0 V, VGS = ± 15 V | 2 | ||
| Gate-Body Leakage | IGSS | -150 | 150 | nA | VDS = 0 V, VGS = ± 10 V | 2 | |
| Gate-Body Leakage | IGSS | -1000 | 1000 | nA | VDS = 0 V, VGS = ± 10 V, TJ = 85 °C | 2 | |
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 5 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 60 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 500 | µA | VDS = 60 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| On-State Drain Current | ID(on) | 500 | mA | VGS = 10 V, VDS = 7.5 V | 2 | ||
| On-State Drain Current | ID(on) | 300 | mA | VGS = 4.5 V, VDS = 10 V | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 2.8 | Ω | VGS = 10 V, ID = 200 mA | 2 | ||
| Drain-Source On-Resistance | RDS(on) | 3.1 | Ω | VGS = 4.5 V, ID = 150 mA | 2 | ||
| Forward Transconductance | gfs | 100 | mS | VDS = 10 V, ID = 100 mA | 2 | ||
| Diode Forward Voltage | VSD | 1.3 | V | IS = 100 mA, VGS = 0 V | 2 | ||
| Total Gate Charge | Qg | 0.4 | 0.6 | nC | VDS = 10 V, VGS = 4.5 V, ID ≅ 150 mA | 2 | |
| Turn-On Time | td(on) | 20 | ns | VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω | 2 | ||
| Turn-Off Time | td(off) | 30 | ns | VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω | 2 | ||
| Drain-Source Voltage | VDS | 60 | V | TA = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TA = 25 °C | 1 | |
| Continuous Drain Current | ID | 250 | mA | TJ = 150 °C, TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | 150 | mA | TJ = 150 °C, TA = 100 °C | 1 | ||
| Pulsed Drain Current | IDM | 800 | mA | 1 | |||
| Power Dissipation | PD | 0.3 | W | TA = 25 °C | 1 | ||
| Power Dissipation | PD | 0.13 | W | TA = 100 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 350 | °C/W | Surface mounted on FR4 board | 1 | ||
| Input Capacitance | Ciss | 25 | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 5 | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 2 | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
BSS138NH6327-VB - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
bss138nh6327-vb-etched.step/bss138nh6327-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bss138nh6327-vb.step/bss138nh6327-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
5a139fd9f079774e, retrieved 2026-11-13, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).
# BSS138NH6327-VB
**VBsemi Elec** · MOSFETs · SOT-23
BSS138NH6327-VB from VBsemi Elec, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; drives the N-channel MOSFET with a maximum gate-source voltage of ±20 V and a typical threshold of 2 V. |
| 2 | S | passive | Source terminal of the N-channel MOSFET, with continuous drain current up to 250 mA at TA = 25 °C. |
| 3 | D | passive | Drain terminal; the drain-source voltage is rated at 60 V and pulsed drain current at 800 mA. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | VDS | 60 | | | V | VGS = 0 V, ID = 10 µA | 2 |
| Gate-Threshold Voltage | VGS(th) | 1 | | 2.5 | V | VDS = VGS, ID = 250 µA | 2 |
| Gate-Body Leakage | IGSS | -10 | | 10 | µA | VDS = 0 V, VGS = ± 20 V | 2 |
| Gate-Body Leakage | IGSS | | | 1 | µA | VDS = 0 V, VGS = ± 15 V | 2 |
| Gate-Body Leakage | IGSS | -150 | | 150 | nA | VDS = 0 V, VGS = ± 10 V | 2 |
| Gate-Body Leakage | IGSS | -1000 | | 1000 | nA | VDS = 0 V, VGS = ± 10 V, TJ = 85 °C | 2 |
| Gate-Body Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ± 5 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = 60 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 500 | µA | VDS = 60 V, VGS = 0 V, TJ = 125 °C | 2 |
| On-State Drain Current | ID(on) | 500 | | | mA | VGS = 10 V, VDS = 7.5 V | 2 |
| On-State Drain Current | ID(on) | 300 | | | mA | VGS = 4.5 V, VDS = 10 V | 2 |
| Drain-Source On-Resistance | RDS(on) | | | 2.8 | Ω | VGS = 10 V, ID = 200 mA | 2 |
| Drain-Source On-Resistance | RDS(on) | | | 3.1 | Ω | VGS = 4.5 V, ID = 150 mA | 2 |
| Forward Transconductance | gfs | 100 | | | mS | VDS = 10 V, ID = 100 mA | 2 |
| Diode Forward Voltage | VSD | | | 1.3 | V | IS = 100 mA, VGS = 0 V | 2 |
| Total Gate Charge | Qg | | 0.4 | 0.6 | nC | VDS = 10 V, VGS = 4.5 V, ID ≅ 150 mA | 2 |
| Turn-On Time | td(on) | | | 20 | ns | VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω | 2 |
| Turn-Off Time | td(off) | | | 30 | ns | VDD = 30 V, RL = 150 Ω, ID ≅ 200 mA, VGEN = 10 V, RG = 10 Ω | 2 |
| Drain-Source Voltage | VDS | | | 60 | V | TA = 25 °C | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | TA = 25 °C | 1 |
| Continuous Drain Current | ID | | | 250 | mA | TJ = 150 °C, TA = 25 °C | 1 |
| Continuous Drain Current | ID | | | 150 | mA | TJ = 150 °C, TA = 100 °C | 1 |
| Pulsed Drain Current | IDM | | | 800 | mA | | 1 |
| Power Dissipation | PD | | | 0.3 | W | TA = 25 °C | 1 |
| Power Dissipation | PD | | | 0.13 | W | TA = 100 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Maximum Junction-to-Ambient | RthJA | | | 350 | °C/W | Surface mounted on FR4 board | 1 |
| Input Capacitance | Ciss | | 25 | | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 |
| Output Capacitance | Coss | | 5 | | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 2 | | pF | VDS = 25 V, VGS = 0 V, f = 1 MHz | 2 |
## CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol: `BSS138NH6327-VB`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files: `bss138nh6327-vb-etched.step` / `bss138nh6327-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bss138nh6327-vb.step` / `bss138nh6327-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/bss138nh6327-vb-datasheet.pdf) (8 pp, sha256 `5a139fd9f079774e`, retrieved 2026-11-13, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).
[Datasheet PDF](docs/bss138nh6327-vb-datasheet.pdf)