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Contents

README

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BSS123NH6433XTMA1

Infineon Technologies · MOSFETs · SOT-23

BSS123NH6433XTMA1 from Infineon Technologies, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the N-channel enhancement-mode MOSFET, logic level 4.5 V rated, with a maximum gate-source voltage of ±20 V.
2 S passive Source of the MOSFET, connected to the body diode anode; continuous drain current is 0.19 A at TA=25 °C.
3 D passive Drain of the MOSFET, rated for VDS of 100 V, 0.19 A continuous and 0.77 A pulsed at TA=25 °C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current ID 0.19 A TA=25 °C 1
Continuous drain current ID 0.15 A TA=70 °C 1
Pulsed drain current ID,pulse 0.77 A TA=25 °C 1
Avalanche energy, single pulse EAS 2 mJ ID=0.19 A, RGS=25 W 1
Reverse diode dv/dt dv/dt 6 kV/µs ID=0.19 A, VDS=80 V, di/dt=200 A/µs, Tj,max=150 °C 1
Gate source voltage VGS -20 20 V 1
Power dissipation Ptot 0.5 W TA=25 °C 1
Operating and storage temperature Tj, Tstg -55 150 °C 1
Soldering temperature 260 °C 1
Thermal resistance, junction - ambient RthJA 250 K/W minimal footprint 2
Drain-source breakdown voltage V(BR)DSS 100 V VGS=0 V, ID=250 µA 2
Gate threshold voltage VGS(th) 0.8 1.4 1.8 V VDS=Vgs V, ID=13 µA 2
Drain-source leakage current IDSS 0.01 mA VDS=100 V, VGS=0 V, Tj=25 °C 2
Drain-source leakage current IDSS 5 VDS=100 V, VGS=0 V, Tj=150 °C 2
Gate-source leakage current IGSS 10 nA VGS=20 V, VDS=0 V 2
Drain-source on-state resistance RDS(on) 2.7 10 W VGS=4.5 V, ID=0.15 A 2
Drain-source on-state resistance RDS(on) 2.4 6 W VGS=10 V, ID=0.19 A 2
Transconductance gfs 0.41 S /VDS/>2/ID/RDS(on)max, ID=0.15 A 2
Input capacitance Ciss 15.7 20.9 pF VGS=0 V, VDS=25 V, f=1 MHz 3
Output capacitance Coss 3.4 4.5 pF VGS=0 V, VDS=25 V, f=1 MHz 3
Reverse transfer capacitance Crss 2.1 3.1 pF VGS=0 V, VDS=25 V, f=1 MHz 3
Turn-on delay time td(on) 2.3 3.5 ns VDD=50 V, VGS=10 V, ID=0.19 A, RG,ext=6 W 3
Rise time tr 3.2 4.6 ns VDD=50 V, VGS=10 V, ID=0.19 A, RG,ext=6 W 3
Turn-off delay time td(off) 7.4 11.1 ns VDD=50 V, VGS=10 V, ID=0.19 A, RG,ext=6 W 3
Fall time tf 22 33 ns VDD=50 V, VGS=10 V, ID=0.19 A, RG,ext=6 W 3
Gate to source charge Qgs 0.04 0.06 nC VDD=50 V, ID=0.19 A, VGS=0 to 10 V 3
Gate to drain charge Qgd 0.23 0.35 nC VDD=50 V, ID=0.19 A, VGS=0 to 10 V 3
Gate charge total Qg 0.6 0.9 nC VDD=50 V, ID=0.19 A, VGS=0 to 10 V 3
Diode continuous forward current IS 0.19 A 3
Diode pulse current IS,pulse 0.77 A 3
Diode forward voltage VSD 0.8 1.1 V VGS=0 V, IF=0.19 A, Tj=25 °C 3
Reverse recovery time trr 12 18 ns VR=50 V, IF=0.19 A, diF/dt=100 A/µs, TA=25 °C 3
Reverse recovery charge Qrr 4.3 6.5 nC VR=50 V, IF=0.19 A, diF/dt=100 A/µs, TA=25 °C 3

CAD (KiCad official)

  • Symbol: BSS123NH6433XTMA1
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bss123nh6433xtma1-etched.step / bss123nh6433xtma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bss123nh6433xtma1.step / bss123nh6433xtma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (9 pp, sha256 05a917d6fe5abf01, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF