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Contents

README

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BSS123-TP

MCC(Micro Commercial Components) · MOSFETs · SOT-23

BSS123-TP from MCC(Micro Commercial Components), in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; voltage-controlled input with a maximum gate-source voltage of ±20 V and a gate threshold of 1.0 V min to 2.8 V max at ID=250 µA.
2 S passive Source terminal of the N-channel MOSFET; the body diode forward voltage is 1.3 V max at IS=0.34 A.
3 D passive Drain; rated for 100 V drain-source voltage and 0.17 A continuous (0.68 A pulsed) drain current.

Key specifications

Parameter Value
Manufacturer MCC(Micro Commercial Components)
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 100 V VGS=0V, ID=250µA 2
Gate-Threshold Voltage VGS(th) 1 2.8 V VDS=VGS, ID=250µA 2
Gate-Body Leakage Current IGSS -50 50 nA VGS=±20V, VDS=0V 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS=100V, VGS=0V 2
Zero Gate Voltage Drain Current IDSS 10 nA VDS=20V, VGS=0V 2
Drain-Source On-Resistance RDS(on) 6 Ω VGS=10V, ID=0.17A 2
Drain-Source On-Resistance RDS(on) 10 Ω VGS=4.5V, ID=0.17A 2
Diode Forward Voltage VSD 1.3 V VGS=0V, IS=0.34A 2
Forward Transconductance gFS 80 mS VDS=10V, ID=0.17A 2
Drain-Source Voltage VDS 100 V 1
Gate-Source Voltage VGS -20 20 V 1
Drain Current-Continuous ID 0.17 A 1
Drain Current-Pulsed IDM 0.68 A 1
Power Dissipation PD 0.35 W 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Tstg -55 150 °C 1
Thermal Resistance Junction to Ambient RθJA 357 °C/W Junction to Ambient 1

CAD (KiCad official)

  • Symbol: BSS123-TP
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bss123-tp-etched.step / bss123-tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bss123-tp.step / bss123-tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MCC(Micro Commercial Components) datasheet (4 pp, sha256 43aea534b413cb9f, retrieved 2026-10-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF