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docs bsp52: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain STEP) · Ray 23d ago
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bsp52-etched.fit.json bsp52: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 1mo ago
bsp52-etched.glb bsp52: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain STEP) · Ray 23d ago
bsp52-etched.step bsp52: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain STEP) · Ray 23d ago
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page.json bsp52: etch along the lead row, tab up; full MPN text (service-occt 1.9.3) (service-occt 1.6.0, from the plain STEP) · Ray 23d ago
README.md bsp52: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 1mo ago

BSP52

Nexperia · Darlington Transistors · SOT-223

BSP52 from Nexperia, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 B input Base of the NPN Darlington. Drives the internal Darlington pair through an integrated base-emitter resistor. VBEsat up to 1.9 V at IC = 500 mA; IB rated to 100 mA max; VEBO = 5 V.
2 C passive Collector of the NPN Darlington (electrically common with pin 4 / heatsink tab). VCES = 80 V, VCBO = 90 V, IC = 1 A continuous (2 A peak); VCEsat up to 1.3 V at IC = 500 mA.
3 E passive Emitter of the NPN Darlington. Anti-parallel integrated diode is connected between collector and emitter.
4 C passive Collector (heatsink tab). Electrically identical to pin 2; provides thermal path for power dissipation. Rth(j-sp) = 17 K/W; Ptot = 1.25 W at Tamb = 25 °C on 1 cm² pad.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOT-223
Category Transistors/Thyristors
Pins 4

Ordering variants

Same part, different packaging or reel option.

  • BSP52

CAD (KiCad official)

  • Symbol: BSP52
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: bsp52-etched.step / bsp52-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bsp52.step / bsp52.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (9 pp, sha256 5cd6bd54ae06e75c, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF