# BSMD1210-050-13.2V

**BHFUSE** · Resettable Fuses · 1210

BSMD1210-050-13.2V from BHFUSE, in a 1210. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the non-polarized PTC device (Ihold 0.50 A, Itrip 1.00 A, Vmax 13.2 Vdc, Imax 100 A), on a 1.00±0.1 x 2.50±0.1 mm pad. |
| 2 | 2 | passive | Second terminal of the non-polarized PTC device, interchangeable with the other terminal, on a 1.00±0.1 x 2.50±0.1 mm pad with 2.00±0.1 mm pad spacing. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | BHFUSE |
| Package | 1210 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current | Ihold |  |  | 0.5 | A | 25℃ still air | 1 |
| Trip current | Itrip | 1 |  |  | A | 25℃ still air | 1 |
| Maximum voltage | Vmax |  |  | 13.2 | Vdc | at rated current (Imax) | 1 |
| Maximum fault current | Imax |  |  | 100 | A | at rated voltage (Vmax) | 1 |
| Minimum resistance | Rmin | 0.1 |  |  | Ω | initial (un-soldered) state | 1 |
| Maximum resistance after trip or reflow | R1max |  |  | 0.9 | Ω | 25℃, measured one hour after tripping or reflow soldering of 260℃ for 20 sec | 1 |
| Power dissipated in tripped state (typical) | Pd typ |  | 0.6 |  | W | tripped state, 25℃ still air | 1 |
| Ambient operating temperature |  | -40 |  | 85 | °C |  | 4 |
| Maximum surface temperature in tripped state |  |  |  | 125 | °C | device in the tripped state | 4 |

## CAD (KiCad official)

- Symbol: `BSMD1210-050-13.2V`
- Footprint: `Fuse:Fuse_1210_3225Metric`
- 3D model: 1210 (KiCad packages3D, STEP)
- 3D model files: `bsmd1210-050-13-2v-etched.step` / `bsmd1210-050-13-2v-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsmd1210-050-13-2v.step` / `bsmd1210-050-13-2v.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [BHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588917969477120000) (7 pp, sha256 `5c6e439fe5a34d2c`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bsmd1210-050-13-2v-datasheet.pdf)