component
BSMD1206L-450
Public Made by Adomby adom
BHFUSE Resettable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BSMD1206L-450
BHFUSE · Resettable Fuses · 1206
BSMD1206L-450 from BHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the non-polarized PTC; BSMD1206L-450 is rated Ihold 4.50 A, Itrip 9.00 A, Vmax 6.0 Vdc and Imax 50 A, and mounts on a 1.00 x 1.80 mm pad (FIG 1 body, 3.45 x 1.80 x 1.00 mm max). |
| 2 | 2 | passive | Other terminal of the non-polarized PTC; BSMD1206L-450 is rated Ihold 4.50 A, Itrip 9.00 A, Vmax 6.0 Vdc and Imax 50 A, and mounts on a 1.00 x 1.80 mm pad with 1.80 mm pad spacing. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BHFUSE |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (Ihold) | Ihold | 4.5 | A | 25℃ still air | 2 | ||
| Trip current (Itrip) | Itrip | 9 | A | 25℃ still air | 2 | ||
| Maximum voltage (Vmax) | Vmax | 6 | Vdc | at rated current (Imax) | 2 | ||
| Maximum fault current (Imax) | Imax | 50 | A | at rated voltage (Vmax) | 2 | ||
| Typical power dissipated in tripped state (Pd typ.) | Pd | 1.2 | W | tripped state, 25℃ still air | 2 | ||
| Time to trip current | 22.5 | A | paired with 5.0 s trip time | 2 | |||
| Time to trip | 5 | Sec | paired with 22.5 A | 2 | |||
| Minimum resistance (Rmin) | Rmin | 0.002 | Ω | initial (un-soldered) state | 2 | ||
| Maximum resistance (R1max) | R1max | 0.011 | Ω | 25℃, measured one hour after tripping or reflow soldering at 260℃ for 20 sec | 2 | ||
| Hold current vs ambient temperature | Ihold | 5.35 | A | ambient -40℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 5.12 | A | ambient -20℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 4.87 | A | ambient 0℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 4.5 | A | ambient 25℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 4.2 | A | ambient 40℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 3.65 | A | ambient 50℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 3.3 | A | ambient 60℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 2.85 | A | ambient 70℃ | 3 | ||
| Hold current vs ambient temperature | Ihold | 2 | A | ambient 85℃ | 3 | ||
| Ambient operating temperature | -40 | 85 | ℃ | ambient operating conditions | 3 | ||
| Maximum surface temperature in tripped state | 125 | °C | device in tripped state | 3 | |||
| Preheat temperature (Tsmin to Tsmax) | 150 | 200 | ℃ | Pb-free reflow, preheat | 4 | ||
| Preheat time (Tsmin to Tsmax) | 60 | 180 | seconds | Pb-free reflow, preheat | 4 | ||
| Time maintained above TL | tL | 60 | 150 | seconds | above TL = 217℃ | 4 | |
| Liquidus temperature TL | TL | 217 | ℃ | time maintained above TL | 4 | ||
| Peak temperature | Tp | 260 | ℃ | Pb-free assembly reflow | 4 | ||
| Average ramp-up rate (Tsmax to Tp) | 3 | ℃/second | Pb-free assembly reflow | 4 | |||
| Ramp-down rate | 6 | ℃/second | Pb-free assembly reflow | 4 | |||
| Time from 25℃ to peak temperature | 8 | minutes | Pb-free assembly reflow | 4 | |||
| Storage temperature | 0 | 30 | ℃ | storage at 30%-60%RH | 4 |
CAD (KiCad official)
- Symbol:
BSMD1206L-450 - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
bsmd1206l-450-etched.step/bsmd1206l-450-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bsmd1206l-450.step/bsmd1206l-450.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: BHFUSE datasheet (7 pp, sha256
786f5f45bdc33acf, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BSMD1206L-450
**BHFUSE** · Resettable Fuses · 1206
BSMD1206L-450 from BHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the non-polarized PTC; BSMD1206L-450 is rated Ihold 4.50 A, Itrip 9.00 A, Vmax 6.0 Vdc and Imax 50 A, and mounts on a 1.00 x 1.80 mm pad (FIG 1 body, 3.45 x 1.80 x 1.00 mm max). |
| 2 | 2 | passive | Other terminal of the non-polarized PTC; BSMD1206L-450 is rated Ihold 4.50 A, Itrip 9.00 A, Vmax 6.0 Vdc and Imax 50 A, and mounts on a 1.00 x 1.80 mm pad with 1.80 mm pad spacing. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | BHFUSE |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Hold current (Ihold) | Ihold | | 4.5 | | A | 25℃ still air | 2 |
| Trip current (Itrip) | Itrip | 9 | | | A | 25℃ still air | 2 |
| Maximum voltage (Vmax) | Vmax | | | 6 | Vdc | at rated current (Imax) | 2 |
| Maximum fault current (Imax) | Imax | | | 50 | A | at rated voltage (Vmax) | 2 |
| Typical power dissipated in tripped state (Pd typ.) | Pd | | 1.2 | | W | tripped state, 25℃ still air | 2 |
| Time to trip current | | | 22.5 | | A | paired with 5.0 s trip time | 2 |
| Time to trip | | | 5 | | Sec | paired with 22.5 A | 2 |
| Minimum resistance (Rmin) | Rmin | 0.002 | | | Ω | initial (un-soldered) state | 2 |
| Maximum resistance (R1max) | R1max | | | 0.011 | Ω | 25℃, measured one hour after tripping or reflow soldering at 260℃ for 20 sec | 2 |
| Hold current vs ambient temperature | Ihold | | 5.35 | | A | ambient -40℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 5.12 | | A | ambient -20℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 4.87 | | A | ambient 0℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 4.5 | | A | ambient 25℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 4.2 | | A | ambient 40℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 3.65 | | A | ambient 50℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 3.3 | | A | ambient 60℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 2.85 | | A | ambient 70℃ | 3 |
| Hold current vs ambient temperature | Ihold | | 2 | | A | ambient 85℃ | 3 |
| Ambient operating temperature | | -40 | | 85 | ℃ | ambient operating conditions | 3 |
| Maximum surface temperature in tripped state | | | | 125 | °C | device in tripped state | 3 |
| Preheat temperature (Tsmin to Tsmax) | | 150 | | 200 | ℃ | Pb-free reflow, preheat | 4 |
| Preheat time (Tsmin to Tsmax) | | 60 | | 180 | seconds | Pb-free reflow, preheat | 4 |
| Time maintained above TL | tL | 60 | | 150 | seconds | above TL = 217℃ | 4 |
| Liquidus temperature TL | TL | 217 | | | ℃ | time maintained above TL | 4 |
| Peak temperature | Tp | | | 260 | ℃ | Pb-free assembly reflow | 4 |
| Average ramp-up rate (Tsmax to Tp) | | | | 3 | ℃/second | Pb-free assembly reflow | 4 |
| Ramp-down rate | | | | 6 | ℃/second | Pb-free assembly reflow | 4 |
| Time from 25℃ to peak temperature | | | | 8 | minutes | Pb-free assembly reflow | 4 |
| Storage temperature | | 0 | | 30 | ℃ | storage at 30%-60%RH | 4 |
## CAD (KiCad official)
- Symbol: `BSMD1206L-450`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `bsmd1206l-450-etched.step` / `bsmd1206l-450-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsmd1206l-450.step` / `bsmd1206l-450.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [BHFUSE datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8619247442572054528) (7 pp, sha256 `786f5f45bdc33acf`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bsmd1206l-450-datasheet.pdf)