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Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
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BSMD1206-075-13.2V

BHFUSE · Resettable Fuses · 1206

BSMD1206-075-13.2V from BHFUSE, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer BHFUSE
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Hold current (Ihold) Ihold 0.75 0.75 A 25℃ still air; maximum current passed without tripping 2
Trip current (Itrip) Itrip 1.5 1.5 A 25℃ still air; minimum current at which device trips 2
Maximum voltage (Vmax) Vmax 13.2 13.2 Vdc Rated current (Imax) 2
Maximum fault current (Imax) Imax 100 100 A Rated voltage (Vmax) 2
Typical power dissipated in tripped state (Pd typ.) Pd 0.6 W Tripped state, 25℃ still air 2
Minimum resistance, initial un-soldered state (Rmin) Rmin 0.09 Ω Initial (un-soldered) state 2
Maximum resistance after trip or reflow (R1max) R1max 0.5 Ω 25℃, measured one hour after tripping or reflow soldering at 260℃ for 20 sec 2
Passive aging resistance change -5 5 % +85°C, 1000 hours; printed as ±5% typical 5
Humidity aging resistance change -5 5 % +85°C, 85% R.H., 168 hours; printed as ±5% typical 5
Thermal shock resistance change -33 33 % +85°C to -40°C, 20 times; printed as ±33% typical 5
Ambient operating temperature -40 85 °C Ambient operating conditions 5
Maximum surface temperature in tripped state 125 °C Device in tripped state 5
Storage temperature 0 30 °C Storage condition 6
Storage relative humidity 30 60 %RH Storage condition 6
Peak reflow temperature (Tp) Tp 260 ℃ Pb-free reflow profile peak temperature 6

CAD (KiCad official)

  • Symbol: BSMD1206-075-13.2V
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: bsmd1206-075-13-2v-etched.step / bsmd1206-075-13-2v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bsmd1206-075-13-2v.step / bsmd1206-075-13-2v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BHFUSE datasheet (10 pp, sha256 71a610bf180ead15, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF