# BSD3C081V

**BORN** · ESD And Surge Protection (TVS/ESD) · SOD-323

BSD3C081V from BORN, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Bidirectional ESD protection terminal with 8.0V reverse stand-off voltage, 9.0V minimum breakdown at 1mA and 27V max clamping at 15A (8/20μs); interchangeable with pin 2. |
| 2 | 2 | passive | Bidirectional ESD protection terminal with 8.0V reverse stand-off voltage, 9.0V minimum breakdown at 1mA and 27V max clamping at 15A (8/20μs); interchangeable with pin 1. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | BORN |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-Off Voltage | VRWM |  |  | 8 | V |  | 2 |
| Reverse Breakdown Voltage | VBR | 9 |  |  | V | IT=1mA | 2 |
| Reverse Leakage Current | IR |  |  | 1 | uA | VRWM=8.0V,T=25℃ | 2 |
| Clamping Voltage | VC |  |  | 27 | V | IPP15A,tp=8/20μs | 2 |
| Junction Capacitance | Cj |  |  | 45 | pF | VR = 0V, f =1MHz | 2 |
| Peak Pulse Power | PPP |  |  | 400 | Watts | tp =8/20μs | 2 |
| Peak Pulse Current | Ipp |  |  | 15 | A | tp =8/20μs | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD |  |  | 30 | kV |  | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD |  |  | 30 | kV |  | 2 |
| Lead Soldering Temperature | TL |  |  | 260 | ℃ | 10seconds | 2 |
| Junction Temperature | TJ | -55 |  | 150 | ℃ |  | 2 |
| Storage Temperature | Tstg | -55 |  | 150 | ℃ |  | 2 |

## CAD (KiCad official)

- Symbol: `BSD3C081V`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `bsd3c081v-etched.step` / `bsd3c081v-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsd3c081v.step` / `bsd3c081v.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [BORN datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586203641129160704) (4 pp, sha256 `ed5d9f111288d623`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bsd3c081v-datasheet.pdf)