# BSD3C051L2-ES

**ElecSuper** · ESD And Surge Protection (TVS/ESD) · SOD-323

BSD3C051L2-ES from ElecSuper, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO | bidirectional | Connects to the IO line; the device is a bidirectional TVS array rated for a 5.0V reverse stand-off voltage (VRWM max) and protects one power or I/O line. |
| 2 | IO | bidirectional | Connects to the IO line; in the bidirectional (AC) configuration it forms the second side of the TVS protection path with pin 1. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | ElecSuper |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power | Ppk |  |  | 400 | W | tp=8/20us @25℃ | 2 |
| Rated reverse stand-off voltage | VRWM |  |  | 5 | V | At TA = 25℃ unless otherwise noted | 3 |
| Minimum breakdown voltage | VBR | 6.5 |  |  | V | @IT = 1mA | 3 |
| Reverse leakage current | IR |  |  | 1 | uA | @VRWM; At TA = 25℃ unless otherwise noted | 3 |
| Maximum peak pulse current | IPP |  |  | 15 | A | At TA = 25℃ unless otherwise noted | 3 |
| ESD (IEC61000-4-2 air discharge) | VESD |  |  | 30 | kV | @25℃; printed as ±30 kV | 2 |
| ESD (IEC61000-4-2 contact discharge) | VESD |  |  | 30 | kV | @25℃; printed as ±30 kV | 2 |
| Junction temperature | TJ |  |  | 150 | ℃ |  | 2 |
| Operating temperature | TOP | -40 |  | 125 | ℃ | Over operating free-air temperature range | 2 |
| Storage temperature | TSTG | -55 |  | 150 | ℃ |  | 2 |
| Lead temperature | TL |  |  | 260 | ℃ |  | 2 |

## CAD (KiCad official)

- Symbol: `BSD3C051L2-ES`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `bsd3c051l2-es-etched.step` / `bsd3c051l2-es-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsd3c051l2-es.step` / `bsd3c051l2-es.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [ElecSuper datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8608742831074918400) (7 pp, sha256 `7078fc3208e1ce21`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bsd3c051l2-es-datasheet.pdf)