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BSD314SPE H6327

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Infineon Technologies MOSFETs, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BSD314SPE H6327

Infineon Technologies · MOSFETs · SOT-363

BSD314SPE H6327 from Infineon Technologies, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 D passive Drain, tied internally with pins 2, 5 and 6 (symbol marks 1,2,5,6); VDS rated -30 V and continuous drain current -1.5 A at TA=25 °C.
2 D passive Drain, tied internally with pins 1, 5 and 6; VDS rated -30 V and continuous drain current -1.5 A at TA=25 °C.
3 G input Gate, ESD protected and logic level (4.5 V rated), with VGS limited to ±20 V.
4 S passive Source of the P-channel MOSFET, with body diode continuous forward current of -0.5 A.
5 D passive Drain, tied internally with pins 1, 2 and 6; pulsed drain current -6.1 A at TA=25 °C.
6 D passive Drain, tied internally with pins 1, 2 and 5; RDS(on) max 140 mΩ at VGS=-10 V.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-363
Category Transistors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage V(BR)DSS -30 V VGS=0V, ID=-250µA 2
Gate threshold voltage VGS(th) -1 -1.5 -2 V VDS=VGS, ID=-6.3µA 2
Drain-source leakage current IDSS -1 mA VDS=-30V, VGS=0V, Tj=25 °C 2
Drain-source leakage current IDSS -100 mA VDS=-30V, VGS=0V, Tj=150 °C 2
Gate-source leakage current IGSS -5 μA VGS=-20V, VDS=0V 2
Drain-source on-state resistance RDS(on) 153 230 mW VGS=-4.5V, ID=-1.2A 2
Drain-source on-state resistance RDS(on) 107 140 mW VGS=-10V, ID=-1.5A 2
Transconductance gfs 3 S /VDS/>2/ID/RDS(on)max, ID=-1.2 A 2
Input capacitance Ciss 221 294 pF VGS=0 V, VDS=-15 V, f=1 MHz 3
Output capacitance Coss 126 168 pF VGS=0 V, VDS=-15 V, f=1 MHz 3
Reverse transfer capacitance Crss 7 11 pF VGS=0 V, VDS=-15 V, f=1 MHz 3
Diode continuous forward current IS -0.5 A TA=25 °C 3
Diode pulse current IS,pulse -6.1 A TA=25 °C 3
Diode forward voltage VSD 0.8 1.1 V VGS=0 V, IF=-1.5A, Tj=25 °C 3
Thermal resistance, junction-ambient RthJA 250 K/W minimal footprint 2
Continuous drain current ID -1.5 A TA=25 °C 1
Continuous drain current ID -1.2 A TA=70 °C 1
Pulsed drain current ID,pulse -6.1 A TA=25 °C 1
Avalanche energy, single pulse EAS 6 mJ ID=-1.5A, RGS=25 W 1
Reverse diode dv/dt dv/dt 6 kV/µs ID=-1.5 A, VDS=-16V, di/dt=-200A/µs, Tj,max=150 °C 1
Gate source voltage VGS -20 20 V 1
Power dissipation Ptot 0.5 W TA=25 °C 1
Operating and storage temperature Tj, Tstg -55 150 °C 1
Soldering temperature 260 °C 1
Turn-on delay time td(on) 5.1 ns VDD=-15V, VGS=-10 V, ID=-1.5 A, RG,ext=6 W 3
Rise time tr 3.9 ns VDD=-15V, VGS=-10 V, ID=-1.5 A, RG,ext=6 W 3
Turn-off delay time td(off) 12.4 ns VDD=-15V, VGS=-10 V, ID=-1.5 A, RG,ext=6 W 3
Fall time tf 2.8 ns VDD=-15V, VGS=-10 V, ID=-1.5 A, RG,ext=6 W 3
Gate to source charge Qgs -0.7 nC VDD=-15 V, ID=-1.5 A, VGS=0 to -10 V 3
Gate to drain charge Qgd -0.3 nC VDD=-15 V, ID=-1.5 A, VGS=0 to -10 V 3
Gate charge total Qg -2.9 nC VDD=-15 V, ID=-1.5 A, VGS=0 to -10 V 3
Gate plateau voltage Vplateau -3.2 V VDD=-15 V, ID=-1.5 A, VGS=0 to -10 V 3
Reverse recovery time trr 12.5 ns VR=-15 V, IF=-1.5A, diF/dt=100 A/µs 3
Reverse recovery charge Qrr 4.3 nC VR=-15 V, IF=-1.5A, diF/dt=100 A/µs 3

CAD (KiCad official)

  • Symbol: BSD314SPE H6327
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: bsd314spe-h6327-etched.step / bsd314spe-h6327-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bsd314spe-h6327.step / bsd314spe-h6327.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (9 pp, sha256 585f36d09e519922, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF