component
BSD235CH6327
Public Made by Adomby adom
Infineon Technologies MOSFETs, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 6d ago |
| viewers | 6d ago |
| bsd235ch6327-etched.glb | 6d ago |
| bsd235ch6327-etched.step | 6d ago |
| bsd235ch6327-hero.glb | 6d ago |
| bsd235ch6327-hero.overlay.json | 6d ago |
| bsd235ch6327.glb | 6d ago |
| bsd235ch6327.kicad_mod | 6d ago |
| bsd235ch6327.kicad_sym | 6d ago |
| bsd235ch6327.lbr | 6d ago |
| bsd235ch6327.step | 6d ago |
| package.json | 6d ago |
| page.json | 6d ago |
| README.md | 6d ago |
BSD235CH6327
Infineon Technologies · MOSFETs · SOT-363
BSD235CH6327 from Infineon Technologies, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | source (N) | passive | Source of the N-channel MOSFET (20 V, 0.95 A, RDS(on) max 350 mΩ at VGS=4.5 V). |
| 2 | gate (N) | input | Gate of the N-channel MOSFET, rated ±12 V maximum VGS with a 1.2 V maximum threshold at 1.6 µA. |
| 3 | drain (P) | passive | Drain of the P-channel MOSFET (-20 V, -0.53 A, RDS(on) max 1200 mΩ at VGS=-4.5 V). |
| 4 | source (P) | passive | Source of the P-channel MOSFET. |
| 5 | gate (P) | input | Gate of the P-channel MOSFET, rated ±12 V maximum VGS with a -1.2 V minimum threshold at -1.5 µA. |
| 6 | drain (N) | passive | Drain of the N-channel MOSFET, 20 V maximum VDS, 0.95 A continuous at TA=25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOT-363 |
| Category | Transistors |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous drain current (P-channel) | ID | -0.53 | A | TA=25 °C | 1 | ||
| Continuous drain current (N-channel) | ID | 0.95 | A | TA=25 °C | 1 | ||
| Continuous drain current (P-channel) | ID | -0.46 | A | TA=70 °C | 1 | ||
| Continuous drain current (N-channel) | ID | 0.76 | A | TA=70 °C | 1 | ||
| Pulsed drain current (P-channel) | ID,pulse | -2.1 | A | TA=25 °C | 1 | ||
| Pulsed drain current (N-channel) | ID,pulse | 3.8 | A | TA=25 °C | 1 | ||
| Avalanche energy, single pulse (P-channel) | EAS | 1.4 | mJ | ID=-0.53 A, RGS=25 W | 1 | ||
| Avalanche energy, single pulse (N-channel) | EAS | 1.6 | mJ | ID=0.95 A, RGS=25 W | 1 | ||
| Gate source voltage | VGS | -12 | 12 | V | 1 | ||
| Power dissipation | Ptot | 0.5 | W | TA=25 °C | 1 | ||
| Operating and storage temperature | Tj, Tstg | -55 | 150 | °C | 1 | ||
| Soldering temperature | Tsolder | 260 | °C | 1 | |||
| Drain-source breakdown voltage (P-channel) | V(BR)DSS | -20 | V | VGS=0 V, ID=-250 µA | 2 | ||
| Drain-source breakdown voltage (N-channel) | V(BR)DSS | 20 | V | VGS=0 V, ID=250 µA | 2 | ||
| Gate threshold voltage (P-channel) | VGS(th) | -1.2 | -0.9 | -0.6 | V | VDS=VGS, ID=-1.5 µA | 2 |
| Gate threshold voltage (N-channel) | VGS(th) | 0.7 | 0.95 | 1.2 | V | VDS=VGS, ID=1.6 µA | 2 |
| Zero gate voltage drain current (P-channel) | IDSS | -1 | µA | VDS=-20 V, VGS=0 V, Tj=25 °C | 2 | ||
| Zero gate voltage drain current (N-channel) | IDSS | 1 | µA | VDS=20 V, VGS=0 V, Tj=25 °C | 2 | ||
| Zero gate voltage drain current (P-channel) | IDSS | -100 | µA | VDS=-20 V, VGS=0 V, Tj=150 °C | 2 | ||
| Zero gate voltage drain current (N-channel) | IDSS | 100 | µA | VDS=20 V, VGS=0 V, Tj=150 °C | 2 | ||
| Drain-source on-state resistance (P-channel) | RDS(on) | 1221 | 2100 | mW | VGS=-2.5 V, ID=-0.17 A | 2 | |
| Drain-source on-state resistance (N-channel) | RDS(on) | 415 | 600 | mW | VGS=2.5 V, ID=0.29 A | 2 | |
| Drain-source on-state resistance (P-channel) | RDS(on) | 745 | 1200 | mW | VGS=-4.5 V, ID=-0.53 A | 2 | |
| Drain-source on-state resistance (N-channel) | RDS(on) | 266 | 350 | mW | VGS=4.5 V, ID=0.95 A | 2 | |
| Gate-source leakage current | IGSS | -100 | 100 | nA | VGS=±12 V, VDS=0 V | 2 | |
| Thermal resistance, junction - ambient (minimal footprint) | RthJA | 250 | K/W | minimal footprint | 2 | ||
| Diode continuous forward current (P-channel) | IS | -0.42 | A | TC=25 °C | 4 | ||
| Diode continuous forward current (N-channel) | IS | 0.5 | A | TC=25 °C | 4 | ||
| Diode pulse current (P-channel) | IS,pulse | -2.1 | A | 4 | |||
| Diode pulse current (N-channel) | IS,pulse | 3.8 | A | 4 | |||
| Diode forward voltage (P-channel) | VSD | -1 | -1.2 | V | VGS=0 V, IF=-0.53 A, Tj=25 °C | 4 | |
| Diode forward voltage (N-channel) | VSD | 0.9 | 1.1 | V | VGS=0 V, IF=0.95 A, Tj=25 °C | 4 |
CAD (KiCad official)
- Symbol:
BSD235CH6327 - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SOT-363 (KiCad packages3D, STEP)
- 3D model files:
bsd235ch6327-etched.step/bsd235ch6327-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bsd235ch6327.step/bsd235ch6327.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (13 pp, sha256
36627c14ac68b261, retrieved 2026-11-04, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).