component
BSC054N04NS G-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, DFN5x6-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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BSC054N04NS G-VB
VBsemi Elec · MOSFETs · DFN5x6-8
BSC054N04NS G-VB from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source terminal of the N-channel MOSFET; pin 1 is marked with a dot on the package. |
| 2 | S | passive | Source terminal of the N-channel MOSFET. |
| 3 | S | passive | Source terminal of the N-channel MOSFET. |
| 4 | G | input | Gate terminal; VGS is rated at ±20 V maximum. |
| 5 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 6 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 7 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 8 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | DFN5x6-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 40 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 70 | A | TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | 60 | A | TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | 19 | A | TA = 25 °C | 1 | ||
| Continuous Drain Current | ID | 18.6 | A | TA = 70 °C | 1 | ||
| Pulsed Drain Current | IDM | 120 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 47.2 | mJ | 1 | |||
| Continuous Source-Drain Diode Current | IS | 70 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | 2.36 | A | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 100 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 55 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 6.15 | W | TA = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 3.07 | W | TA = 70 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 47 | 56 | °C/W | t 10 s | 1 | |
| Maximum Junction-to-Ambient | RthJA | 90 | °C/W | Steady state (note d) | 1 | ||
| Maximum Junction-to-Case | RthJC | 0.8 | 1.1 | °C/W | Steady state | 1 | |
| Drain-Source Breakdown Voltage | VDS | 40 | V | VGS = 0 V, ID = 250 µA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | 1.2 | 2.5 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 40 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS = 40 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | 70 | A | VDS 5 V, VGS = 10 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.006 | Ω | VGS = 4.5 V, ID = 29 A | 2 | ||
| Gate Resistance | Rg | 1.4 | 2.1 | Ω | f = 1 MHz | 2 | |
| Turn-On Delay Time | td(on) | 18 | 27 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 | |
| Rise Time | tr | 11 | 17 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 | |
| Turn-Off Delay Time | td(off) | 70 | 105 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 | |
| Fall Time | tf | 10 | 15 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 | |
| Turn-On Delay Time | td(on) | 55 | 83 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 | |
| Rise Time | tr | 180 | 270 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 | |
| Turn-Off Delay Time | td(off) | 55 | 83 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 | |
| Fall Time | tf | 12 | 18 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 | |
| Continuous Source-Drain Diode Current | IS | 70 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | 100 | A | 2 | |||
| Body Diode Voltage | VSD | 0.8 | 1.2 | V | IS = 22 A | 2 | |
| Body Diode Reverse Recovery Time | trr | 52 | 78 | ns | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 70.2 | 105 | nC | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 |
CAD (KiCad official)
- Symbol:
BSC054N04NS G-VB - Footprint:
Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm - 3D model: DFN5x6-8 (KiCad packages3D, STEP)
- 3D model files:
bsc054n04ns-g-vb-etched.step/bsc054n04ns-g-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bsc054n04ns-g-vb.step/bsc054n04ns-g-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
0cfcdde30e43e1d5, retrieved 2026-10-29, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# BSC054N04NS G-VB
**VBsemi Elec** · MOSFETs · DFN5x6-8
BSC054N04NS G-VB from VBsemi Elec, in a DFN5x6-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source terminal of the N-channel MOSFET; pin 1 is marked with a dot on the package. |
| 2 | S | passive | Source terminal of the N-channel MOSFET. |
| 3 | S | passive | Source terminal of the N-channel MOSFET. |
| 4 | G | input | Gate terminal; VGS is rated at ±20 V maximum. |
| 5 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 6 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 7 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 8 | D | passive | Drain terminal; VDS is rated at 40 V maximum. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | DFN5x6-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 9 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 40 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | | | 70 | A | TC = 25 °C | 1 |
| Continuous Drain Current | ID | | | 60 | A | TC = 70 °C | 1 |
| Continuous Drain Current | ID | | | 19 | A | TA = 25 °C | 1 |
| Continuous Drain Current | ID | | | 18.6 | A | TA = 70 °C | 1 |
| Pulsed Drain Current | IDM | | | 120 | A | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 47.2 | mJ | | 1 |
| Continuous Source-Drain Diode Current | IS | | | 70 | A | TC = 25 °C | 1 |
| Continuous Source-Drain Diode Current | IS | | | 2.36 | A | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 100 | W | TC = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 55 | W | TC = 70 °C | 1 |
| Maximum Power Dissipation | PD | | | 6.15 | W | TA = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 3.07 | W | TA = 70 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 175 | °C | | 1 |
| Maximum Junction-to-Ambient | RthJA | | 47 | 56 | °C/W | t 10 s | 1 |
| Maximum Junction-to-Ambient | RthJA | | | 90 | °C/W | Steady state (note d) | 1 |
| Maximum Junction-to-Case | RthJC | | 0.8 | 1.1 | °C/W | Steady state | 1 |
| Drain-Source Breakdown Voltage | VDS | 40 | | | V | VGS = 0 V, ID = 250 µA | 2 |
| Gate-Source Threshold Voltage | VGS(th) | 1.2 | | 2.5 | V | VDS = VGS, ID = 250 µA | 2 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = 40 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 10 | µA | VDS = 40 V, VGS = 0 V, TJ = 55 °C | 2 |
| On-State Drain Current | ID(on) | 70 | | | A | VDS 5 V, VGS = 10 V | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.006 | Ω | VGS = 4.5 V, ID = 29 A | 2 |
| Gate Resistance | Rg | | 1.4 | 2.1 | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | | 18 | 27 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 |
| Rise Time | tr | | 11 | 17 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 |
| Turn-Off Delay Time | td(off) | | 70 | 105 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 |
| Fall Time | tf | | 10 | 15 | ns | VDD = 15 V, RL = 0.555, ID 27 A, VGEN = 10 V, Rg = 1 | 2 |
| Turn-On Delay Time | td(on) | | 55 | 83 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 |
| Rise Time | tr | | 180 | 270 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 |
| Turn-Off Delay Time | td(off) | | 55 | 83 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 |
| Fall Time | tf | | 12 | 18 | ns | VDD = 15 V, RL = 0.625, ID 24 A, VGEN = 4.5 V, Rg = 1 | 2 |
| Continuous Source-Drain Diode Current | IS | | | 70 | A | TC = 25 °C | 2 |
| Pulse Diode Forward Current | ISM | | | 100 | A | | 2 |
| Body Diode Voltage | VSD | | 0.8 | 1.2 | V | IS = 22 A | 2 |
| Body Diode Reverse Recovery Time | trr | | 52 | 78 | ns | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 |
| Body Diode Reverse Recovery Charge | Qrr | | 70.2 | 105 | nC | IF = 20 A, di/dt = 100 A/µs, TJ = 25 °C | 2 |
## CAD (KiCad official)
- Symbol: `BSC054N04NS G-VB`
- Footprint: `Package_DFN_QFN:DFN-S-8-1EP_6x5mm_P1.27mm`
- 3D model: DFN5x6-8 (KiCad packages3D, STEP)
- 3D model files: `bsc054n04ns-g-vb-etched.step` / `bsc054n04ns-g-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bsc054n04ns-g-vb.step` / `bsc054n04ns-g-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/bsc054n04ns-g-vb-datasheet.pdf) (7 pp, sha256 `0cfcdde30e43e1d5`, retrieved 2026-10-29, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/bsc054n04ns-g-vb-datasheet.pdf)